Alpha and Omega Semiconductor Limited (AOS) has released a family
of low on-resistance 8 V, 20 V, and 30 V MOSFETs in the ultra-thin
molded chip scale package (MCSP). The MCSP devices feature a maximum
height of 0.3 mm to provide a solution for ultra-slim designs.
Compared to existing CSP solutions the new family reduces
package height by 50% and improves the overall mechanical robustness of
the package. The performance enhancements offered by the MCSP
technology, make these new devices ideal for the latest ultra-portable
applications such as smart phones, tablet PCs, ultrabooks, and other mobile hand-held devices.
The proprietary MCSP packaging technology encapsulates AOS' low
on-resistance MOSFET silicon in a protective Green (halogen-free)
molding compound. The resulting product provides a thinner and more
robust structure to solve die chipping and placement issues associated
with standard CSP products. The new family of MCSP devices offers major
performance benefits and at the same time can easily replace industry
standard CSP devices by offering the same footprint, pin-out, and
The new portfolio of MCSP products includes n- and p-channel devices
with VDS ratings from 8 V to 30 V in package options of 0.97 mm x 0.97
mm and 1.57 mm x 1.57 mm. AOC2414, AOC2421, and AOC2422 have guaranteed
ultra-low on-resistance rated at 1.2 VGS which helps designers to
simplify drive circuitry, lower power consumption and extend battery
life in ultra-portable applications.
Availability and Pricing
All mentioned devices are available in production quantities with a
lead-time of 12 weeks. The unit price for 1,000 pieces ranges from $0.23
to $0.30, depending on the device.
More information about the MCSP devices at www.aosmd.com/search?q=MCSP
This article originally appeared in EE Times Europe.