TE Connectivity (TE) has launched a line of M.2 next-generation form factor (NGFF) connectors, which are designed using the new interface standard for a smaller form factor in both size and volume.
TE has designed two M.2
(NGFF) products with either a standard top PCB mount or a midplane
(offset) PCB mount. The M.2 connectors are designed in a dense form
factor of just 0.5mm pitch with 67 positions.
TE’s latest M.2 (NGFF) products are engineered for a wide range of applications, including SSDs (solid state drives) and wireless cards of all types for use in notebooks, ultraportable devices, tablets, desktops and servers.
“As the market shifts toward slimmer solutions, we see M.2 (NGFF) products as the natural transition from the PCI Express Mini Card to a smaller, standardized form factor,” said Jaren May, global product manager of TE Consumer Devices, in a statement. “As M.2 (NGFF) connectors are in the early phase of their product lifecycle, we’re working with industry standard committees, as well as other innovative companies, to lead the market towards slimmer designs.”
- Provides a range of profile heights
- Supports enhanced data rates, which include PCI Express 3.0, SATA 3.0 and USB 3.0
- Saves more than 20 percent of PCB real estate
- Reduces connector height by 15 percent (as compared to PCI Express Mini Card connectors)
- Ensures proper mating configurations with module cards through several keying options
- Accepts both single- and double-sided modules
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