NURNBERG, Germany Aaeon, Adlink, and Advantech our cooperating with Kontron to turn its nanoETXexpress board design into a industry specification.
The small computer-on-modules (COM) form factor nanoETXexpress (84 mm x 55 mm) design was launched by Kontron (Eching, Germany) in April 2008. Now the four module vendors have jointly released revision 1.0 of the nanoETXexpress specification, which now includes serial digital video out (SDVO) support.
They will present the nanoETXexpress form factor to the PICMG consortium for incorporation into one of the next COM Express releases under the proposed neutral name 'Ultra'.
The companies are also proposing a slightly larger 'compact' module measuring 95 x 95mm be taken into the COM Express specification. Currently, the COM Express specification includes the 'basic' (95 x 125mm) and 'extended' (110 x 155mm) form factors.
"We support the 'Ultra' form factor because it fits perfectly into our product portfolio. We have already implemented the Intel Atom™ processor on our COM-U15 COM Express computer-on-module. The step to implementing the nanoCOM-U15 was therefore easy," said Peter Yang, AAEON Product Manager ECD, responsible for computer-on-modules at AAEON (Taipei, Taiwan).
"In the market for computer-on-modules oriented designs we have seen how customers have shown a clear preference towards a single open standard: PICMG's COM Express," said Henk van Bremen, product director for ADLINK's (Taipei, Taiwan) Embedded Division. "By proposing this new 'Ultra' small form factor that remains fully pin and signal compatible with PICMG's COM Express Type 1, we can leverage COM Express success and use its existing design ecosystem and collateral."
Aaron Su, product manager of Advantech (Taipei, Taiwan) added, "Since it is based 100 percent on the pinouts and connector locations used in the already established and proven COM Express Type 1 specification, developing a small form factor computer-on-module in accordance with the COM Express™ specification is the securest long-term investment."
"The support of these three other major computer-on-modules vendors underlines the fact that nanoETXexpress is a safe investment," said Dirk Finstel, CTO of Kontron. "In addition, the market for the COM Express Type 1 interconnects is very strong with an expected CAGR of 70 percent up to 2010 according to VDC. This is why we expect the 'Ultra' small computer-on-module specification to become the de facto standard for small form factor designs based on computer-on-modules."
Revision 1.0 of the nanoETXexpress Computer-on-Modules specification enables SDVO signal transport via a separate flat foil connector. The LVDS output on the COM Express connector can also be retained and used alongside digital visual interface (DVI), giving designers the possibility of designing-in extra graphic interfaces on the carrier board to enable dual display solutions.
Revision 1.0 of the nanoETXexpress specification is available for
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