Well, this one took me somewhat by surprise, because thus far I'd never seen the words 'halogen' and 'CPLD' in the same sentence (I've obviously lived a sheltered life), but we live and learn...
Just to make sure we're all tap-dancing to the same drum beat, the halogens are a series of nonmetal elements comprising fluorine (F), chlorine (Cl), bromine (Br), iodine (I), and astatine (At). Owing to their high reactivity, the halogens are found in the environment only in compounds or as ions.
Anyway, I just heard that the folks at Lattice Semiconductor have announced the availability of halogen- and lead-free packages for their ispMACH 4000ZE CPLD family, which is a popular programmable logic solution for high-volume consumer electronics. Bromine and chlorine – halogens associated with ozone depletion – have been replaced with metal oxides or red phosphorous.
Lead and halogens have been eliminated from several components of the ispMACH 4000ZE IC package material to comply fully with industry standards such as Japan’s JEIDA and Europe’s WEEE. For lead-frame based packages, the plating process has been modified to remove lead, and halogens have been removed from die-attach and mold compounds that encapsulate the IC.
"Halogen elements are used in some IC substrate material, and in sufficient quantities they can be harmful to biological organisms. Manufacturers of consumer electronics devices are concerned about the environmental impact of their products," said Gordon Hands, Director of Marketing for Low Density and Mixed Signal Solutions. "Lattice is excited to provide our customers with programmable logic devices that allow them to meet higher standards for electronic waste while still meeting their power and cost targets. The ispMACH 4000ZE is a proven green PLD for use in devices as diverse as portable GPS and mobile handsets, to digital set top boxes (STBs) and multi-function printers."
Lead- and halogen-free package options
Lattice has qualified a wide variety of package types in lead-free configurations. These qualified packages include the Plastic Leaded Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Fine Pitch BGA (fpBGA), Fine Pitch Thin BGA (ftBGA), Chip Scale BGA (csBGA), Ultra Chip Scale BGA (ucBGA), Chip Array BGA (caBGA), Flip Chip BGA (fcBGA), and Quad Flat-pack Saw-singulated (QFNS). Lattice’s lead-free packages offer the same high quality and reliability benefits as devices that contain lead. For more information on Lead-Free, RoHS Compliant Packaging Support from Lattice, visit the Lattice web site at www.latticesemi.com/rohs
All TQFP package variations and the 64-Ball csBGA package of the ispMACH 4000ZE family are now halogen free and use pure tin (Sn 100%) for lead plating.
Environmental information from Lattice
Lattice publishes a variety of environmental information resources on its website:
Quality, Reliability and Environmental Information
Device Material Content
Lead Free, RoHS Compliant Packaging Support
Pricing and availability
All ispMACH 4000 CPLDs are fully production-qualified and have been shipping for ten years. ispMACH 4000 CPLDs feature a broad range of densities, packages and speed grade options and are available for ordering via the Lattice online store at www.latticesemi.com/store
and through authorized Lattice distributors at www.latticesemi.com/sales
ispMACH 4000 CPLDs are available for $0.50 for 32-macrocell devices in high volume. For more information about the Lattice ispMACH 4000ZE CPLD family, visit www.latticesemi.com/ispmach4000ze