Toshiba America Electronic Components, Inc. (TAEC) has introduced a family of 24-nanometer (nm) e-MMC devices. The company expects that the use of toggle-mode double data rate (DDR) NAND will improve performance and enable faster random access and sequential performance. With densities ranging from 2-gigabyte(1) (GB) to 128GB, these new embedded NAND flash memory modules feature one of the highest capacities achieved in the industry and offer full compliance with the JEDEC embedded multimedia card (e-MMC) Version 4.41 standard.
Integrating up to 128GB NAND and an e-MMC controller, Toshiba's 24nm e-MMC devices combine up to 16 pieces of 64Gbit (equal to 8GB) NAND chips. Toshiba reports that its 24nm e-MMC process lowers costs, enables higher densities, boosts performance and allows for smaller packages. This makes the devcies well suite for use in space-conscious applications such as smartphones, tablet PCs, eBooks, digital video cameras, printers, servers, and POS systems.
Samples of 8GB, 16GB, 32GB and 64GB 24nm e-MMC product family are available now, and mass production will begin in Q3, with other densities to follow.
Join our online Radio Show on Friday 11th July starting at 2:00pm Eastern, when EETimes editor of all things fun and interesting, Max Maxfield, and embedded systems expert, Jack Ganssle, will debate as to just what is, and is not, and embedded system.