Toshiba America Electronic Components, Inc. (TAEC) has introduced a family of 24-nanometer (nm) e-MMC devices. The company expects that the use of toggle-mode double data rate (DDR) NAND will improve performance and enable faster random access and sequential performance. With densities ranging from 2-gigabyte(1) (GB) to 128GB, these new embedded NAND flash memory modules feature one of the highest capacities achieved in the industry and offer full compliance with the JEDEC embedded multimedia card (e-MMC) Version 4.41 standard.
Integrating up to 128GB NAND and an e-MMC controller, Toshiba's 24nm e-MMC devices combine up to 16 pieces of 64Gbit (equal to 8GB) NAND chips. Toshiba reports that its 24nm e-MMC process lowers costs, enables higher densities, boosts performance and allows for smaller packages. This makes the devcies well suite for use in space-conscious applications such as smartphones, tablet PCs, eBooks, digital video cameras, printers, servers, and POS systems.
Samples of 8GB, 16GB, 32GB and 64GB 24nm e-MMC product family are available now, and mass production will begin in Q3, with other densities to follow.