DESIGN West, San Jose, March 27, 2012 Ė Texas Instruments Incorporated (TI) unveiled three new devices based on its KeyStone multicore architecture utilizing the TMS320C66x digital signal processors (DSP) generation. TIís new TMS320C665x DSPs feature combined fixed- and floating-point capabilities, delivering real-time high performance at low power coupled with smaller form factors.
With TIís new TMS320C6654, TMS320C6655 and TMS320C6657 multicore DSPs, developers can more effectively meet vital requirements of high performance and portable applications in markets such as mission critical, industrial automation, testers, embedded vision, imaging, video surveillance, medical, audio and video infrastructure.
Based on the KeyStone multicore architecture, TIís new C665x processors offer developers access to devices that are high performance while still being power and space efficient. The low power consumption and small form factor of 21mm x 21mm enable portability, mobility and low power energy sources such as battery and interface powering to drive breakthrough products. The unique strengths of these C665x DSPs meet the need of applications such as video security and traffic management, where there is a need to carry out both video processing and analytics at the end point. In addition, a wide range of high performance real-time applications such as on-board radar, software defined radios, video and image processing and portable ultrasound will now be smaller, lighter and easier to use.
Starting just under $30 at 10 KU, TIís C665x processors consist of three fully pin compatible low-cost, power optimized solutions for developers migrating from single core to multicore. The C6657 features two 1.25-GHz DSP cores, delivering up to 80 GMACs and 40 GFLOPs, while the C6655 and C6654 single core solutions deliver up to 40 GMACs and 20 GLOPS and 27.2 GMACs and 13.6 GLOPS, respectively. Under normal operating conditions, the C6657, C6655 and C6654 power numbers are at 3.5W, 2.5W and 2W, respectively. TIís C665x DSPs also feature large on-chip memory coupled with a high bandwidth and efficient external memory controller, making them an ideal choice for developers of mission critical, test and automation, imaging, medical and audio and video infrastructure applications where low latency is critical.
The new DSPs support extended temperature ranges from -55C to 100C for applications required to work under extreme physical conditions or provide sustained operating life. This feature makes the C665x DSPs ideal for mission critical, outdoor imaging and analytics applications, where high reliability is a key requirement. In addition, the C665x DSPs provide abundant performance and connectivity to tackle the challenging specifications in imaging applications, including high bandwidth serial interfaces such as RapidIO, PCIe and Gigabit Ethernet and the ability to extend processing to a pool of DSPs. An optimized set of peripherals, including Universal Parallel Port (UPP) and Multichannel Buffered Serial Ports (McBSP), in TIís C665x processors, reduce system cost and size, as well as simplify migration from previous designs with minimal board redesign.
Simplified development with complete tools and support
TI offers easy-to-use, low cost evaluation modules (EVMs) so developers can quickly get started designing with the C6654, C6655 and C6657. The TMDSEVM6657 sells for $349 and the TMDSEVM6657LE sells for $549. Both EVMs include a free Multicore Software Development Kit (MCSDK), TIís powerful Code Composer Studioô (CCS) integrated development environment (IDE), and suite of application/demo codes to allow programmers to quickly come up to speed on the new platform. In addition, TIís TMDSEVM6657L includes an embedded XDS100 emulator while the TMDSEVM6657LE includes a faster emulator, the XDS560V2, for quicker program load and ease of use.
on image to enlarge.
C665x Evaluation Module
C665x DSPs are code compatible with TIís TMS320C64x generation and all of TIís KeyStone-based multicore processors, ensuring previous investments made on TI DSPs can be easily reused. This flexibility allows developers the ability to easily design a wide portfolio of high performance products, scaling from low to high end applications. Availability
Order entry is open today for both the C665x EVMS, as well as the C665x devices. Pricing for the C6654 DSP starts just under $30 for 10 KU.
Visit TI at DESIGN West Booth 1320
to learn more about the latest embedded processing news and to check out a broad range of TI demos.
For more information please visit www.ti.com/multicore