The DIP1524 from STMicroelectronics is a tiny 1.14 mm2 antenna-sharing IC for 4G smartphones capable of delivering high signal strength to several RF receivers simultaneously. The new IC is designed to meet the need of 4G smartphones to use multiple cellular connections to deliver mobile broadband services at speeds of more than 100 Mbps. With Bluetooth, Wi-Fi, and GPS built in, some of the handset’s receivers must share an antenna to save space. The DIP1524 will enable smartphones to offer faster GPS startup time (time to first fix), more accurate position detection, and more reliable location-based services that benefit from strong connections to several satellites.
The DIP1524 diplexer utilizes ST’s Integrated Passive Device (IPD) technology, fabricated on a glass substrate that minimizes insertion losses compared to the ceramic substrates used by other manufacturers. Its flip-chip package has a footprint the same size as the chip itself, thereby occupying 65% less pc-board area than competing devices in conventional packages with a total footprint larger than 3 mm2. The DIP1524 enables handset designers to connect receivers for GPS/GLONASS satellites, Bluetooth, Wi-Fi and LTE band 7 to the same antenna.
- GPS insertion loss: 0.65 dB (max.)
- GLONASS insertion loss: 0.75 dB (max.)
- Zero performance drift
- High channel isolation
- No value dispersion between components
The DIP1524-01D3 is sampling now in a 4-bump flip-chip package, and will be available in high volumes priced from $0.129 for orders over 1000 pieces. Alternative higher-volume pricing options are available on request. For more information visit www.st.com