SAN FRANCISCO — Analog and mixed-signal foundry Dongbu HiTek yesterday said it would expand volume production of 2-megapixel CMOS image sensors for Chinese fabless chip customer BYD Co. Ltd.
According to Dongbu, of Seoul, S. Korea, BYD expects to ship its substantial quantities of 2-megapixel CMOS image sensors to major Chinese smartphone manufacturers, including Huawei.
According to Jae Song, executive vice president of marketing at Dongbu, in addition to building BYD's 2-megapixel image sensors, Dongbu is also supporting the company's development of 5-megapixed CMOS image sensors.
"We expect our relationship to blossom further into the development and manufacture of 8M CIS chips," said Song.
Dongbu announced in May that it would sharpen its focus on serving Chinese customers by establishing offices in Shanghai, Beijing, and Shenzhen. The firm said it is already manufacturing a wide range of chips for Chinese customers, including touch-screen controllers, ambient light proximity sensors, and power management chips as well as the CMOS image sensors.