Analog and sensor IC company AMS AG, formerly known as Austriamicrosystems, has invested more than €25 million (about US$33 million) to create 3D IC production capacity at its wafer fab at Unterpremstaetten, near Graz, Austria.
AMS said in a press release that it had made the move because of "soaring demand" for stacked-die services based on through-silicon via (TSV) integration that the company has developed.
The 3D IC production line will be fully operational by the end of 2013, AMS said, and available for use by any AMS product or foundry customer. Initially, the line is being loaded with production of devices for medical imaging and mobile phones.
The use of TSVs rather than bond wires is allowing the production of smaller multi-die component packages with superior performance, the company said. AMS gave the example of a photodiode die and a silicon signal-processing die that the AMS process allows to be bonded back-to-back. This can replace two separate packages with one, has a smaller footprint, and shorter interconnects result in improved performance and reduced production of and susceptibility to electrical noise.