China's largest foundry, Semiconductor Manufacturing International Corp., has announced the availability of multiple nonvolatile memory types at both the 180- and 130nm process nodes. The company said it is also developing an embedded flash memory process for the 55-nm node with a production target of 2014's second quarter.
At the two larger nodes, SMICs nonvolatile memory options now include EEPROM, Flash, OTP (one-time programmable), and multi-time programmable, the company said in a press release. For each platform, SMIC can provide a physical design kit and memory compiler. It also includes I/O cells, phase-locked loops, ADC, a security-related light sensor, and a voltage detector IP. Other specialty components include embedded DRAM and embedded fuse elements.
SMIC said the embedded nonvolatile memory platform is suitable for use in such applications as SIM cards, social security cards, transportation cards, and bank cards and microcontroller applications in the consumer, industrial, and automotive sectors.
"This is part of our differentiation strategy to bring added value to customers and targeting sustainable growth and profitability to SMIC," said Tzu-Yin Chiu, CEO of SMIC, in the statement.