PORTLAND, Ore. — Intel Capital announced investments of $65 million in 16 companies in nine countries at its annual Intel Capital Global Summit 2013 (October 21-23) in San Diego, Calif., where over 1,000 executives, movers, and shakers from the technology and investment community gathered.
The companies in which Intel Capital announced investments spanned a wide spectrum of new technologies, from wireless energy transfer to cloud computing to mobile and consumer services.
Why are these chief executive officers smiling? They are CEOs of the companies in which Intel just invested $65 million, along with with Arvind Sodhani, president of Intel Capital and Intel executive vice president.
(SOURCE: Intel Capital)
A few of the highlights include WiTricity Corp. in Watertown, Mass., which has demonstrated the wireless transfer of electricity using magnetically coupled resonance between matched antennas. Originally invented at the Massachusetts Institute of Technology (MIT) by professor Marin Soljacic, the company has been quietly recruiting original equipment manufacturers (OEMs) in several electronics industry segments, including consumer, automotive, medical, and defense, and is preparing to come out of the closet soon. Also participating in the Series E financing was Hon Hai (Foxconn) in Taiwan as well as other investors injecting a total of $25 million into WiTricity.
Another interesting inclusion in the Intel Capital roster was the Rocketick Technology Ltd. (Ramat-Gan, Israel), which specializes in accelerating EDA chip simulations using multicore graphics processing units (GPUs). Rocketick translates Verilog hardware description language (HDL) code into threads that can be processed in parallel thereby accelerating large chip simulations by 10-to-30 times. The company claims its redesign of the traditional simulation database allows it to scale over multiple GPUs and take immediate advantage of the speedup afforded by new models as they are released. GPU-maker NVIDIA and several other investors also participated in the $3 million Series C funding round.
Also included was SBA Materials Inc. in Albuquerque, N.M., which specializes in nanoscale porous dielectric materials using its proprietary liquid phase self-assembly technique designed to enhance the performance of both semiconductor logic chips and energy storage technologies. SBA designs a variety of siloxane-based materials with novel electrical, optical, and mechanical properties, including advanced low-k dielectrics that aim to boost the performance and lower the power consumption of the next-generation of chips used in mobile devices.
High-speed interconnectivity specialist Lintes Technologies (Taiwan) was also funded for its custom designed Thunderbolt electro-optical cable interconnects for connecting servers and PCs that operate as fast as 100 gigabits per second.
3D software specialists DotProduct LLC in Houston, Texas, were also included for their real-time image capture system for Android tablets. Called Phi.3D, the software essentially turns an Android tablet into a 3D video image capture and processing studio, which can be used for everything from gaming and entertainment to documenting crime scenes.
In the cloud computing, storage, and service spaces, Intel Capital also announced investments in CloudFS (Singapore), Cloudian (Japan), and FileForce (Japan).
Other companies included in Intel Capitals' funding efforts included Interlude (Israel) for its interactive video technology, Mobiles Republic (France/USA) for its mobile new syndicator software, Perpetuuiti TechnoSoft Services (Singapore/India) for its IT disaster-recovery platform, Reduxio Systems (Israel) for its fault-tolerant data storage solution, SkySQL (Finland), Prism Skylabs (USA), and Savaari Car Rentals (India).