Breaking News
Intel to Customize High-End Processors
11/20/2013

Image 1 of 2      Next >

Intel has already integrated onto its CPUs math coprocessors, memory controllers, graphics, I/O controllers, and now in-package memory with Knights Landing. Next will be high-speed switches, optical fabrics, next-generation storage, and 3D stacked memory CPUs. (Source: Intel)
Intel has already integrated onto its CPUs math coprocessors, memory controllers, graphics, I/O controllers, and now in-package memory with Knights Landing. Next will be high-speed switches, optical fabrics, next-generation storage, and 3D stacked memory CPUs.
(Source: Intel)

Image 1 of 2      Next >

Return to Article

View Comments: Newest First | Oldest First | Threaded View
<<   <   Page 2 / 2
R_Colin_Johnson
User Rank
Blogger
Re: Knights Landing in 14nm
R_Colin_Johnson   11/20/2013 11:15:41 AM
NO RATINGS
I asked them specifically if they would use a 2.5-D silicon interposer, but all they would say is that it will be "high bandwidth".

rick merritt
User Rank
Author
Re: Knights Landing in 14nm
rick merritt   11/20/2013 11:12:58 AM
NO RATINGS
It will be interesting to see if Intel uses the 2.5-D approach Xilinx pioneered or...

R_Colin_Johnson
User Rank
Blogger
Knights Landing in 14nm
R_Colin_Johnson   11/20/2013 10:40:07 AM
NO RATINGS
One thing I forgot to mention is that the next-generation Xeon Phi will be implemented in Intel's 14-nanometer process technology--which should shrink the die even though the whole package may stay the same size or even grow depending on how many memory die are added is alongside the processor.

<<   <   Page 2 / 2
August Cartoon Caption Winner!
August Cartoon Caption Winner!
"All the King's horses and all the KIng's men gave up on Humpty, so they handed the problem off to Engineering."
5 comments
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Flash Poll
Radio
NEXT UPCOMING BROADCAST
How to Cope with a Burpy Comet
October 17, 2pm EDT Friday
EE Times Editorial Director Karen Field interviews Andrea Accomazzo, Flight Director for the Rosetta Spacecraft.