Adding fluorine atoms (yellow) to a 2-D monolayer of tin atoms (grey) should allow a predicted new material, stanene, to offer zero resistance along its edges (blue and red arrows) at temperatures up to 100 degrees Celsius (212 Fahrenheit). (Yong Xu/Tsinghua University; Greg Stewart/SLAC) (Source: SLAC)
I'm interested in the dynamic that I see in this "invention". The inventors hypothesize a property of a material that has yet to be produced or tested. I can't help but wonder whether the actual material will reveal issues not anticipated in the model just as working from Newtonian physics doesn't predict the remarkable properties of relativity (to say nothing of many much more mundane examples). I also wonder about the intellectual property; if indeed Stanene does have the predicted properties, is it now public domain?
Re: 20 years...I am afraid this is how long it takes from first recent announcement to mature technology when new material is invented, this is not writing a new app on the iPhone...look at graphene, already 10 years or so in the making and still close to zero revenue...Europe just founded one of the two largest research initiatives to develop graphene science (the other initiative is on brain) so they fully anticipate at least another 5 years before graphene matures...Kris
Thanks - 100C seems low for active circuits - if the resistance spiked while carrying current I assume it would be reclassified as a switch at best and fuse at worst....
20 years !! I suppose I am a bit jaded, but that seems like a long time - I am also interested in this new "superconductive" insulator property - has it been used for anything yet? Can you put anything near it, or is there some dielectric effect that would create problems - does it need to be in a vacuume?
As a Monty Python fan I prefer Tim Valley anyway. Tin is toxic after all.
No resistance would imply no resistive heating and no scattering (meaning low noise) I think. Also no RC delay. Of course you have to connect it somehow to something, and then you will have resistance. I wonder about the dielectric constant of the ribbon and how much cross talk between the two sides will be a factor. It might not be feasible to use both sides separately, but it could give a neat way to do error checking/correction.
I think we are good 10-20 years before fully knowing answers to your questions @chrisfolsom...this is how long I bet the technology will take to mature...BTW, I don't see 100C (212F) as a major limitation, most applications don't require it...Kris
This seems like a major step although the 212F deg limit seems to limit application quite a bit. The implications of designing on a computer new materials has much larger implications though. I had a few questions regarding application if anybody had some quick comments or ideas:
Is this believed to be easily compatible with present chip manufacturing processes?
Could this be used in other applications then just on chip - boards, wires, motors?
What would be the implications of using this for information transfer - I have little experience - with less resistence how will this affect noise in a circuit - besides just less heat/resistence? Could it transmit dc to microwave efficiently?
There is a misspelling - Tim Valley should be Tin Valley..
I agree. Stanene is new to me but there is no question we are moving into a new age and that silicon has taken us about as far as it can. The use of monolayers of tin to reduce heat and save power within the chip is an exciting breakthrough. No surprise that so many advanced institutions are getting in on the action now.
David Patterson, known for his pioneering research that led to RAID, clusters and more, is part of a team at UC Berkeley that recently made its RISC-V processor architecture an open source hardware offering. We talk with Patterson and one of his colleagues behind the effort about the opportunities they see, what new kinds of designs they hope to enable and what it means for today’s commercial processor giants such as Intel, ARM and Imagination Technologies.