SAN JOSE, Calif. — Sensor fusion is increasingly becoming the secret sauce for the Internet of Things. Experts will lay out some of the ingredients for that recipe in a panel at the IoT Engineering Summit at EE Live! in April.
Tomorrow's breakthrough IoT systems likely will be the result of engineers who found new ways to combine inputs from multiple sensors to deliver new services. "It is only our imaginations that limit the combinations of sensors and types of useful data fusion," said Tom Hackenberg, a principal analyst at market watcher IHS who will moderate the panel.
The first wave of sensors used in consumer electronics devices were accelerometers, gyroscopes, and magnetometers focused on motion data. Now a broader set of barometers, haptic sensors, proximity sensors, thermometers, light sensors, microphones, image sensors, and other sensors are coming down the pike, he noted.
On the panel, Marcellino Gemelli, a former sensor engineer and now a business development manager at Bosch Sensortec, will describe some of those new MEMS sensors and ways they are being integrated with transmitters. Jay Esfandyari, a director of MEMS application engineering at STMicroelectronics, will describe how multiple sensors are being packed with programmable controllers on integrated devices. And Tim Davis, CTO at Kionix, will share some of the challenges using these parts, such as keeping them calibrated.
Don't forget that EE Live! 2014 All Access passes and Engineering Summits passes are still available at the conference's official site with discounted advance pricing. Make sure to follow updates about EE Live!'s other talks, programs, and announcements on its social media accounts on Twitter, Facebook, LinkedIn, and Google+.
EE Live! and the Embedded Systems Conference are owned by UBM Tech, which also owns EE Times.
— Rick Merritt, Silicon Valley Bureau Chief, EE Times