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3D Chip Stack Tool Sends TSV Into High-Volume
5/28/2014

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The TSV (orange) connects the bumps on the bottom of the chip stack to the redistribution layer (RDL) at the top of the chip which connects to the next chip with micro-bumps.
(Source: Applied Materials)
The TSV (orange) connects the bumps on the bottom of the chip stack to the redistribution layer (RDL) at the top of the chip which connects to the next chip with micro-bumps.
(Source: Applied Materials)

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Kinnar
User Rank
CEO
Re: Misleading Headline?
Kinnar   5/30/2014 9:56:17 AM
NO RATINGS
That's really a great news and fact figure, and the volumetric production and the huge demand of memory is actually in strict demand of such technology and yes it is really a very good news that people are working hard to make this idea usable in volumetric productions of ICs. 

Kinnar
User Rank
CEO
Re: Misleading Headline?
Kinnar   5/30/2014 9:50:44 AM
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That will require another incremental development to correctly mould this idea in actual practice including cost concerns.

R_Colin_Johnson
User Rank
Blogger
Re: credible reporting on science & technology requires avoiding Hype
R_Colin_Johnson   5/29/2014 5:50:01 PM
NO RATINGS
how many of those 30 customers for this AMAT tool are using it for TSVs

I assumed that all 30 are using Ventura for TSVs, but I just checked with Applied Materials to make sure my memory served me well, and they confirmed that Applied Materials has "sent 30 chambers to multiple customers.  And yes, Ventura was developed specifically for fabricating TSVs."

Thank you very much for your query. Its good to make sure that all our published facts are checked and verified. Thanks again.

chipmonk0
User Rank
CEO
credible reporting on science & technology requires avoiding Hype
chipmonk0   5/29/2014 4:13:49 PM
NO RATINGS
and how many of those 30 customers for this AMAT tool are using it for TSVs ??

R_Colin_Johnson
User Rank
Blogger
Re: Misleading Headline?
R_Colin_Johnson   5/29/2014 1:43:54 PM
NO RATINGS
I don't write the final headline, my suggested headline read:

World's First 3-D TSV Volume Manufacturing Tool

But in defense of our headline writers, AM does already have 30 customers, some working with the tool for as long as 18 months, which "sends" could resonably be argued to accurately describe :)

wilber_xbox
User Rank
Manager
Re: Misleading Headline?
wilber_xbox   5/29/2014 1:37:16 PM
NO RATINGS
I also think that these are incremental improvements but whether there are enough for companies to switch to 3D stack for cost is not yet clear.

Kinnar
User Rank
CEO
Re: Misleading Headline?
Kinnar   5/29/2014 2:54:15 AM
NO RATINGS
You are right; this is actually a incremental development or stepping stone for the high volume production of 3D Chips. This kind of incremental developments are really required in increasing manufacturability of 3D Chips.

Francoise.vonTrapp
User Rank
Freelancer
Misleading Headline?
Francoise.vonTrapp   5/28/2014 11:35:00 PM
While I agree that AMAT's HVM tool for PVD of barrier and seed layers is exciting news, lets not get ahead of ourselves by making false claims in the title just to get the click-throughs. TSVs will go into HVM when the volume orders start rolling in from customers. A more accurate title would be "HVM PVD Tool Enables Industry to Manufacture 3D IC Stacks in High Volume." 

R_Colin_Johnson
User Rank
Blogger
Re: Ti barrier metal
R_Colin_Johnson   5/28/2014 6:20:51 PM
NO RATINGS
Using Ti instead of tantalum as barrier cuts cost according to AM. Cu goes inside the barrier--as usual.

Martini Tech
User Rank
Rookie
Re: Ti barrier metal
Martini Tech   5/28/2014 3:06:04 PM
NO RATINGS
Cu as filling of TSV has already been used since long time ago.

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