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Ziptronix & EVG Improve Wafer Alignment

6/9/2014 01:15 PM EDT
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krisi
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CEO
submicron
krisi   6/10/2014 2:29:22 PM
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Sounds extremely impressive but why would need sub-micron alignment capability for 300mm wafer?

docdivakar
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CEO
Re: submicron
docdivakar   6/10/2014 3:58:38 PM
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@krisi As referenced in the article, one of the alignment challenges is the tolerance stackup for microbumps and TSV's. I have seen IMEC's roadmap where the microbumps are less than 30um in dia and the TSV's are heading lower than 5um. Without the submicron alignment accuracy needed, wafer to wafer bonding will not be realized!

MP Divakar

krisi
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CEO
Re: submicron
krisi   6/10/2014 5:12:37 PM
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aha...TSVs, they can be 5um or so...sub-um alignment makes sense, thank you @docdivekar!

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