Breaking News
News & Analysis

Ziptronix & EVG Improve Wafer Alignment

6/9/2014 01:15 PM EDT
3 comments
NO RATINGS
More Related Links
View Comments: Threaded | Newest First | Oldest First
krisi
User Rank
CEO
submicron
krisi   6/10/2014 2:29:22 PM
NO RATINGS
Sounds extremely impressive but why would need sub-micron alignment capability for 300mm wafer?

docdivakar
User Rank
Manager
Re: submicron
docdivakar   6/10/2014 3:58:38 PM
NO RATINGS
@krisi As referenced in the article, one of the alignment challenges is the tolerance stackup for microbumps and TSV's. I have seen IMEC's roadmap where the microbumps are less than 30um in dia and the TSV's are heading lower than 5um. Without the submicron alignment accuracy needed, wafer to wafer bonding will not be realized!

MP Divakar

krisi
User Rank
CEO
Re: submicron
krisi   6/10/2014 5:12:37 PM
NO RATINGS
aha...TSVs, they can be 5um or so...sub-um alignment makes sense, thank you @docdivekar!

Flash Poll
Radio
LATEST ARCHIVED BROADCAST
EE Times editor Junko Yoshida grills two executives --Rick Walker, senior product marketing manager for IoT and home automation for CSR, and Jim Reich, CTO and co-founder at Palatehome.
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed