DesignCon 2015 has extended its deadline for abstract submissions to Friday, July 18, 2014.
With the Fourth of July festivities last week, the conference organizers decided to give you an extra week to submit your abstract.
DesignCon gives chip, board, and systems design engineers the unique opportunity to gather for four days and learn the latest design techniques, methodologies, and tools around signal integrity, power integrity, high-speed serial design, PCB design tools, test and measurement, and more.
Be sure to join this elite group by offering your case studies, technology innovations, practical techniques, design tips, and application overviews. Submit your abstract for the chance to share your expertise in the areas of signal and power integrity, test and measurement, and verification.
Martin Rowe, Senior Technical Editor