Power management of mobile devices is in the news following the recent announcement by the Transportation Security Administration that any electronic devices that don't power up on inspection will not be permitted on direct flights to the United States. In addition, says the TSA, the owners of any such devices "may also undergo additional screening."
The new rule is designed to reduce the possibility of such devices being used to smuggle explosive material aboard aircraft -- i.e., by someone replacing the battery and/or the internal electronics of mobile devices with a bomb (or part of one). Critics, however, suggest that an engineer (or clever terrorist) can probably figure out fairly easily a way for a device to pass a quick "turn-on test" using far fewer electronics and power components than a fully working unit, while still leaving plenty of room to build in any desired extra "functionality."
Researchers at Washington State University have developed a wireless multicore chip design that they claim could reduce energy consumption at large datacenters by as much as 20%. According to the researchers, by using direct wireless links between processor cores to exchange data instead of multi-hopping among cores using physical wires, the "wireless network-on-a-chip" technology results in lower energy loss and higher data transfer speed. For more, see "Research could lead to dramatic data farm energy savings" and "Dual-Level DVFS-Enabled Millimeter-Wave Wireless NoC Architectures."
A multicore chip incorporating millimeter-wave, on-chip, wireless links offers significantly lower power and higher bandwidth than traditional mesh-based counterparts and could potentially help reduce datacenter energy consumption by up to 20%.
In product news, SL Power has introduced a power supply for applications requiring extraordinarily high electromagnetic compliance and resilience against RF irradiation and mains interference, such as test-and-measurement equipment and industrial process controls. The 425 W TU425 series AC/DC supply meets the IEC61000-4 standard for EMI and requirements for wirebound emissions class B at a safety margin of 6 dB.
Efficient Power Conversion (EPC) has announced six new eGaN power transistor products and development boards. The EPC2023, EPC2024, EPC2020, EPC2021, EPC2022, and EPC2019 range from 30 to 200 V with a max RDS(on) of 1.3 to 43 mΩ.
Linear Technology has introduced the LTC3124 15 V, 5 A, 2-phase synchronous step-up DC/DC converter with output disconnect and inrush current limiting. The company also announced the LT3669 IO-Link PHY-compatible industrial transceiver that integrates a high-efficiency step-down regulator and LDO.
Alpha and Omega Semiconductor has rolled out a new family of 25 and 30 V high-performance MOSFETs in 3x3 mm DFN packaging. The AON7760, AON7510, AON7758, AON7764, AON7536, and AON7538 offer an RDS(on) as low as 1.3 mΩ and a 20% figure-of-merit improvement over the previous generation.
X-REL Semiconductor has extended its family of XTR2N0x high-temperature MOSFETs with new mid-power P-channel devices. The XTR2N0325 and XTR2N0350 are intended for a maximum operation VDS of -30 V, while the XTR2N0525 and XTR2N0550 can sustain a VDS of up to -50 V.
Finally, new inductors from Total Frequency Control integrate a metal core, for high saturation currents, and a unique resin-coated shielding layer within a miniature SMD package. The MA series and MD series inductors range in value from 0.47 to 4.7 µH and operate over -40 to +85°C.