You said: "3D packaging with through silicon vias is five to ten years out"
I beg to differ! Tezzaron is doing it now. They combine different process flows, different geometries, different substrates, different die dimensions... All manufactured for their customers as 3D-ICs with TSVs. It's very exciting.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments