Intel has announced that its wireless charging bowl -- a prototype of which it unveiled at CES in January -- will be available on the market by the end of this year. Approximately 10 inches in diameter and using magnetic resonance technology based on the A4WP standard, the bowl and accompanying stand can charge multiple devices simultaneously without requiring exact placement, Intel says. (See video below.)
Based on magnetic resonance technology, Intel's smart wireless charging bowl will be capable of simultaneously charging multiple devices placed inside it without requiring exact alignment or placement.
Almost Applesque in design, the idea was conceived by Intel workers looking to find an easy way to charge wearable devices. They originally prototyped the concept using a jury-rigged chips bowl purchased from Walmart. Of all the company's CES announcements, Intel says the charging bowl was the concept that achieved the most interest.
In product news this week, Linear Technology announced the LT3999 monolithic 1-A, 1-MHz push-pull isolated DC/DC transformer driver, which operates over an input voltage range of 2.7-36 V. The company also introduced the LTC2946 rail-to-rail system monitor that measures current, voltage, power, charge, and energy and reports data via an I2C interface.
Intersil announced a 4.1V single-cell battery charger designed to extend the life of Li-ion batteries in automotive emergency call (e-call) systems. The ISL78692 operates from as low as 2.65 V and features a reverse battery leakage of 700 nA.
Elmos Semiconductor has introduced a USB charger IC with protection features for the automotive environment. The E522.41 supports all USB charging downstream loads according to the Battery Charging Specifications (rev. 1.2) and emulates all currently known specific USB charging devices.
A synchronous rectifier controller from Dialog Semiconductor is designed to enable small, higher-power adapters for mobile devices. The iW671 uses digital adaptive turn-off control technology to replace the secondary-side Schottky diode with a MOSFET for high-power-density power supplies.
CUI has extended its PBK line of ultra-compact SIP AC-DC power supplies. The low-profile PBK-B series is available in 1W, 3W, and 5W configurations in single-output voltages of 3.3 Vdc, 5 Vdc, 9 Vdc, 12 Vdc, 15 Vdc, and 24 Vdc.
Vishay Intertechnology introduced 15 new 200V Gen-2 TMBS Trench MOS barrier Schottky rectifiers. Available in TO-263AB and TO-262AA packages, the 5A V(B,I)T5202, the 10A V(B,I)T10202C, the 20A V(B,I)20202G and V(B,I)20202C, and the 30A V(B,I)30202C feature a maximum operating junction temperature of +175°C.
Power Sources Unlimited has announced 1W SIP unregulated high-I/O-isolation DC/DC converters. The TMV-HI Series comprises 40 models covering input voltage ranges of 5 VDC, 12 VDC, 15 VDC, and 24 VDC, along with single (3.3-, 5-, 9-, 12-, and 15-VDC) or dual (±5-, ±9-, ±12-, ±15-, and ±15/-9-VDC) outputs.
An 85V full-bridge MOSFET driver from Micrel features adaptive-dead-time and shoot-through protection. The MIC4606 features a 5.5-to-16V gate drive supply operating range and offers four independent inputs (MC4606-1) or two PWM inputs (MIC4606-2).
Efficient Power Conversion announced an enhancement-mode monolithic GaN transistor half bridge. Integrating two eGaN power FETs into a single device, the EPC2100 features a VDS of 30V and an RDS(on) of 8 (Q1, Control FET) and 2 mΩ (Q2, Sync FET), respectively.
Behlman has introduced the latest in a family of COTS DC/DC power supplies. The VPXtra 500M VITA 62, Open-VPX-compliant, 3U power supply accepts an 18-to-36VDC input and delivers 550 W via six outputs.
Finally, Rohde & Schwarz has added features to some of its lab power supplies. The HMC804x series supplies now include tracking, sequencing, and FuseLink functionality, as well as data logging and an integrated energy meter.