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CMOS Image Sensors Surpassing Moore's Law

3-D sensors quickly evolving from TSVs to Cu-Cu bonding
2/12/2015 09:36 AM EST
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chipmonk0
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Re: TSV, Cu-Cu, and hybrid bonding
chipmonk0   2/16/2015 12:03:03 PM
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In future it would be helpful to establish the credibility of market research firms if they are upfront about the technology they describe including its pedigree. Talking about EVG ( a mechanical placement tool supplier in Austria ) now when Ziptronix ( N. Carolina ) is the main technology developer for DBC etc. hardly makes up for such omissions. Past hyping of TSV technology in the context of Wide I/O etc. w/o recognizing the technical challenges of TSVs ( stress, thermal, memory refresh, .. ) may have sold more reports but has been misleading.

R_Colin_Johnson
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Re: TSV, Cu-Cu, and hybrid bonding
R_Colin_Johnson   2/13/2015 5:36:12 PM
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Astronut0: thanks for the tip. Very interesting reading. Lots of detail in their TSV based work with lots of promise for hybrid bonding. Thanks for the links.

Astronut0
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Re: TSV, Cu-Cu, and hybrid bonding
Astronut0   2/13/2015 4:27:02 PM
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Tezzaron is also a Ziptronix licensee.  They did the actual bonding of the Fermilab 3D sensor, per this:
http://www.tezzaron.com/fermilab-3d-sensor-breakthrough/

Dr. Deptuch's report of the results is very interesting:
https://indico.cern.ch/event/309449/session/25/contribution/24/material/slides/1.pdf

R_Colin_Johnson
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Re: TSV, Cu-Cu, and hybrid bonding
R_Colin_Johnson   2/13/2015 1:03:09 PM
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@Chipmonk0: Yole says that "Ziptronics is the provider of the technology we are referring to (IP). There are different licensing agreements in play; Sony is definitely working with Ziptonics IP concerning stacked BSI, for hybrid BSI, as far as we know this is a trade secret. We are not aware of any disclosure from Sony yet."

You were right about Sony having licensing deals--Ziptronic's revealed Sony as a licensee back in 2011 for its ZiBond technology, which is not intended for Cu-to-Cu allignment. But maybe Sony has other licenses or has developed the technology on their own. Do you have a source claiming Sony has already achieved Cu-to-Cu wafer-scale bonding?

pcambou
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Re: TSV, Cu-Cu, and hybrid bonding
pcambou   2/13/2015 11:17:59 AM
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Ziptronics is the undisputed leader of fusion and hybrid bonding. Nothing new under the sun. CMOS Image sensors are the main users of fusion bonding technology, and might be the main user of hybrid technology. There is a subble difference when Fermi Lab or Sony adopt a technology, a few billion US$ subttelty.

Yole published an article on its website with one of the Ziptronics IP licencee, EVG

http://www.i-micronews.com/imaging-news/5045-how-ev-group-became-the-key-supplier-for-cmos-image-sensors-manufacturing.html

R_Colin_Johnson
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Re: TSV, Cu-Cu, and hybrid bonding
R_Colin_Johnson   2/12/2015 2:38:59 PM
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@Astronut0: thanks for the tips. Fermilab and Johns Hopkins are good customers to have. i'm quereying Yole now as to their analysis of Ziptronix and Tezzaron's 3-D processes. Thanks again.

Astronut0
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Re: TSV, Cu-Cu, and hybrid bonding
Astronut0   2/12/2015 2:35:28 PM
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Ziptronix/Tezzaron 3D sensor customers include:

Fermilab -
http://www.marketwired.com/press-release/fermilab-implements-ziptronixs-dbi-hybrid-bonding-in-high-end-3d-image-sensors-1945190.htm

Johns Hopkins University (JHU) and Universidad Nacional del Sur (UNS) -
http://www.tachyonsemi.com/3DVideoProcessor.html
with images published in 2012 here:
https://www.youtube.com/watch?v=88br5L9WMBo

 

R_Colin_Johnson
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Re: TSV, Cu-Cu, and hybrid bonding
R_Colin_Johnson   2/12/2015 2:29:13 PM
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@chipmonk0: thanks for the tip, I'll querey Yole about their understanding of the Ziptronix process. I'm not sure if its an example or that they are speaking of something different/denser. Thanks again for the comment.

chipmonk0
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Re: TSV, Cu-Cu, and hybrid bonding
chipmonk0   2/12/2015 2:21:44 PM
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@ Colin please get Yole to be specific about what they mean by hybrid bonding and who is developing / doing it. Otherwise your article will be a disservice to Ziptronix of N. Carolina which pioneered Cu - Cu direct bonding that Sony has been using in image sensor products for 3 yrs. 

R_Colin_Johnson
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Re: TSV, Cu-Cu, and hybrid bonding
R_Colin_Johnson   2/12/2015 2:04:04 PM
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Astronut0: Good observation, thanks. Both Ziptronix and Tezzaron use both TSVs and Cu-to-Cu in wafer-scale bonding for a variety of applications--they say, but I'm not aware of customers yet. Besang has a deal with Hynix to create 3-D chips without the need for wafer bonding, but have not come to market yet and are behind schedule. 3-D CMOS chips use similar to wafer bonding technology, but may come to market first because of the incredible demand for smaller and smaller CMOS sensors.

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