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3D NAND Flash at 2 Cents per GB

BeSang wants to lower barrier to 3D NAND flash
7/18/2016 07:10 PM EDT
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TanjB
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Re: why stalled?
TanjB   7/20/2016 1:02:00 AM
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Check your web site for contact request.

Sang-Yun
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Re: why stalled?
Sang-Yun   7/19/2016 10:01:13 PM
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As explained, TRUE 3D IC (which was developed a while ago) is a platform technology and 3D Super-NAND is a product technology. Customers want to know how the technology could be used for their own products. So, IP company should provide details of product applications. BeSang has full confidence to apply its TRUE 3D IC technology for 3D Super-NAND product development. A fab is ready to support product development at 15nm or 20nm technology node. 128Gb to 1Tb product could be delivered within 1.5 years. We will see if BeSang's claims are real in the market or just exagguration soon. 

Sang-Yun
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Re: why stalled?
Sang-Yun   7/19/2016 9:54:34 PM
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My name is Sang-Yun Lee, CEO of BeSang Inc. Thank you for your question. Many people ask the same qution to me. There are two main reasons. One is the NIH (Not Invented Here) syndrome. NIH barrier is especially high in the semiconductor industry. I think such high barrier causes lack of innovation and fast aging of the semiconductor industry. BeSang is too small to overcome the NIH syndrome so far. The other reason is that BeSang did not have a chance to delivery enough information about 3D Super-NAND product even though BeSang successfully developed 3D IC technology. The tutorial video explains the issues of traditional 3D NAND and solution to fix the problems with 3D Super-NAND. You may wonder how BeSang's TRUE 3D IC and 3D Super-NAND are different. BeSang's 3D IC is a Paltform Technology which has standarized 3D IC structure and interchangable 3D memory cells. This Platform Technology could drastically reduce manufacturing cost. For more information, please check the following video - https://www.youtube.com/watch?v=h7LSOiQ_CLs.    

TanjB
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Re: why stalled?
TanjB   7/19/2016 9:24:28 PM
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Perhaps Colin can simply ask them?  Many good reasons could have happened, but it would be polite to ask.

The history is honestly listed at http://www.besang.com/news.html and you can see a 2009 news item http://www.besang.com/files/KAIST_Newsletter.pdf clearly showing the same general circuit element and what seems to be a test wafer.

Kevin Neilson
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Re: why stalled?
Kevin Neilson   7/19/2016 7:57:17 PM
There is the possibility that it doesn't really work and their claims are exaggerated.

TanjB
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why stalled?
TanjB   7/19/2016 7:38:25 PM
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A simple search shows reports on essentially the same memory cell back as far as 2009.  What have been the reasons for this approach to languish?

andy3D
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Re: Intriguing but .....
andy3D   7/19/2016 6:14:58 PM
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Thanks Colin

R_Colin_Johnson
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Re: Intriguing but .....
R_Colin_Johnson   7/19/2016 6:12:36 PM
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BeSang gave me the same reference, but thought TechInsights had given you the illustration since you say "What a feast of information Techinsights has given us" in your introduction. Now you've been duly credited. Thanks.

andy3D
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Re: Intriguing but .....
andy3D   7/19/2016 6:05:54 PM
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Yes. Here you go. Probably just an oversight:

 

http://www.3dincites.com/2014/12/samsungs-3d-v-nand-flash-product-ceaselessly-marching/

 

Andy

R_Colin_Johnson
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Re: Intriguing but .....
R_Colin_Johnson   7/19/2016 5:29:48 PM
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Sorry, Andy. That's the source that BeSang gave me. Do you have a URL for the story that I can share with others.

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