REGISTER | LOGIN
Breaking News
News & Analysis

Intel Boots Drives with 3D XPoint

3D XPoint DIMMs already sampling
3/19/2017 12:01 PM EDT
17 comments
NO RATINGS
1 saves
< Previous Page 2 / 2
More Related Links
View Comments: Newest First | Oldest First | Threaded View
Page 1 / 2   >   >>
Ron Neale
User Rank
Author
Yield improvements and cooking CMOS
Ron Neale   3/22/2017 1:30:27 PM
NO RATINGS
Rick:-Suggesting that the 50% improvement in performance needed for use in DIMMs will be achieved as the yield increases is interesting. This must be interpreted that for the present generation of devices the performance is limited by unknown defect(s) resulting in some devices in all arrays not meeting the intended specification; meaning lower performance arrays are being sampled. Then the performance limiting defects will somehow apparently disappear as a function of increases in yield. Otherwise they would be already delivering at least some arrays with the 50% improvement, more of which will be obtained when the yield improves and a much larger number of arrays meet the same performance level.

Is the problem with CMOS, the matrix isolation device (selector) and temperature related to processing or operation?
The selector devices will be switching on every read cycle as well as the write cycles. Threshold switching is a combination of electronic and thermal effects. If for a particular composition the thermal effect dominates then the CMOS will be cooked during both read and write operations. One intriguing question is have Intel found a threshold switching selector material where the electronic effect dominates or have found one which requires fabrication and post-deposition drift-eliminating annealing temperatures compatible with CMOS fabrication. Some clarification on those points would help judge the likelihood of success.

resistion
User Rank
Author
Re: Doesn't look like SCM
resistion   3/22/2017 6:39:46 AM
NO RATINGS
Retention, not endurance, thanks.

DataStorage
User Rank
Author
Re: 10,000 wpm?
DataStorage   3/22/2017 4:00:08 AM
NO RATINGS
"especially the selector diode which needs to work at the low temperatures of a CMOS back-end process." Why low temperature? Does it mean the temperature lower than 300K, OR should it be HIGH temperature?

rick merritt
User Rank
Author
Re: Doesn't look like SCM
rick merritt   3/21/2017 11:49:20 AM
NO RATINGS
OK, I'm checking woth their PR contact to see if I can get something more specific on endurance.

rick merritt
User Rank
Author
Re: 10,000 wpm?
rick merritt   3/21/2017 11:45:19 AM
NO RATINGS
Al Fazio noted the Fab 68 in Dalian as one now ramping 3D NAND and implied it could be used for 3DXP if needed, but in my brief talk with him it sounded like they hope 3DXP will fill Lehi fab and Dalian is an option if demand exceeds expectations.

resistion
User Rank
Author
Re: 10,000 wpm?
resistion   3/21/2017 9:22:51 AM
NO RATINGS
Will they run/ramp this in China Fab 68?

resistion
User Rank
Author
Re: Doesn't look like SCM
resistion   3/21/2017 3:01:17 AM
NO RATINGS
It's not listed, unspecified.

rick merritt
User Rank
Author
Re: 10,000 wpm?
rick merritt   3/21/2017 2:28:49 AM
NO RATINGS
@geekmaster: Al Fazio told me the Lehi fab running 3D NAND is now running single-digit 3DXP wafers

rick merritt
User Rank
Author
Re: Doesn't look like SCM
rick merritt   3/21/2017 2:27:45 AM
NO RATINGS
@resistion and @elizabethsimon: All the specs Intel is providing are now here:

https://www-ssl.intel.com/content/www/us/en/solid-state-drives/data-center-family.html

Not enough?

geekmaster
User Rank
Author
10,000 wpm?
geekmaster   3/20/2017 5:54:03 PM
NO RATINGS
Rick! How do you know that "The fab is currently running less than 10,000 3D XPoint wafers/month"? Also: do they also run 3D NAND?

 

Page 1 / 2   >   >>

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed