The company was founded in September 2009 with the mission of commercializing a method for integrating MEMS motion sensors above electronic circuitry in a standard CMOS wafer fab using through-silicon via connections. The process includes hermetic sealing of the assembly.
The inherent advantage that Lee talks about is primarily size. The use of wafer bonding and through-silicon-vias (TSVs) allows mCube to produce a combination inertial sensor in a package measuring 3mm by 3mm, without needing bond wiring and bond pads inside the package.
Three generational approaches to making inertial MEMS. (Source: mCube)
While market leaders Bosch and STMicroelectronics use traditional hybrid manufacturing techniques they have been challenged more recently by InvenSense with its stacked chip approach, Lee indicated in a slide presentation. But all three will now be challenged by mCube with is monolithic CMOS approach which can dispense with bond wire and bond pads to produce smaller size and lower parasitic capacitance resulting in better accuracy, he claimed.
The approach gives mCube an advantage in terms of die size, packaged footprint, sensor accuracy, and energy consumption, Lee claims. This in turn will not only let mCube steal design slots from its better-established peers in smartphones and tablet computers but will also help the company help drive wearable equipment and Internet of Things markets.