Nearly very semiconductor research group worldwide is gearing up to produce carbon-based electronics as the successor to silicon, but in fact carbon materials can also be made into transparent conductors and insulators, plus can be used for optical communications and photovoltaics as well as doped with vacancies to make magnetic materials (shown here).
Not only is graphene--the planar version of carbon--faster and more power efficient power than silicon, but an often overlooked benefit is how lightweight devices made from them could become. Today much of the weight of electronic devices is due to all the copper used for interconnects, but a smartphone using carbon for its conductors, semiconductors and insulators could be nearly as light as styrofoam.
Graphene will first be used to enhance the thermal conductivity of heat spreaders and as a replacement for transparent indium-tin-oxide (ITO), but by 2023 it will be possible to fabricate nearly everything electronic with carbon materials.
Nice list... how ever, I object to your statement that "3-D chips are one of those perennially "almost there" technologies..."; they are here NOW! Samsung already introduced a 8Gb version of RDRAM with TSV's. You can expect more product announcements in 2013.
Graphene, on the other hand is REALLY the 3-D chips are one of those perennially "almost there" technologies! As to its heat spreading capabilities, there are circuit board technologies available today that use carbon composites for better thermal management (Stablecore for example).
David Patterson, known for his pioneering research that led to RAID, clusters and more, is part of a team at UC Berkeley that recently made its RISC-V processor architecture an open source hardware offering. We talk with Patterson and one of his colleagues behind the effort about the opportunities they see, what new kinds of designs they hope to enable and what it means for today’s commercial processor giants such as Intel, ARM and Imagination Technologies.