Among the chip suppliers in the Nexus 7 are familiar companies like Maxim, providing the main power management IC (MAX77612A), and Texas Instruments with two design wins also related to the power management. Hynix also won a socket for memory with its 2 Gb DDR3 SDRAM modules on the main board. We also found a 8-Gb memory module from Kingston manufactured by SanDisk/Toshiba and a PN65 NFC secure module from NXP. The latter device was recently found in the Samsung Galaxy S3.
Broadcom was another notable design winner with it BCM4330 802.11n with Bluetooth wireless transceiver and BCM4751 integrated GPS receiver. The BCM4330 is paired with an AzureWave AW-NH665 802.11n Wi-Fi/Bluetooth/FM radio module.
Among the chip makers not usually seen in tablets is ELAN Microelectronics, which provided controllers for the Nexus 7’s touchscreen. We have previously seen ELAN microcontrollers in handsets manufactured for the Chinese market, so the Nexus 7 represents a major design win for the Taiwanese vendor.
The combination of a high-end processor, a multitude of applications optimized for Android 4.1 Jelly Bean and a $199 price tag for the 8 Gb model give Google a chance to make a dent in the tablet market. Early indications are that the pre-orders for the Nexus 7 are substantial. If Google succeeds with Nexus 7, the pressure will grow on Apple to introduce its own 7-inch model, the protests of the late Steve Jobs notwithstanding.
Nvidia Tegra 3: Quad-core mobile applications processor
Hynix H5TC2G83CFR: 2 Gb DDR3 SDRAM
Kingston KE44B026BN: 8GB memory module
Realtek (RMC) ALC5642: Audio codec and headphone amplifier
InvenSense MPU-6050: Six-axis (gyro and accelerometer) MEMS device
AzureWave AW-NH665: 802.11n Wi-Fi/Bluetooth/FM radio module
NXP Semiconductor PN65: Secure NFC module
Back side view of the Nexus 7 communications board (click on image to enlarge).
Allan Yogasingam is a technical research manager at UBM TechInsights, a sister company to EE Times. For a closer look at the UBM TechInsights teardown analysis of the Nexus 7, please visit the firm's website.
a belated thx. from your photos it appears that the 4 Hynix DDR 3L chips are on both the front and back of the motherboard - 2 a side. Unlike PoP config they are not on the SoC but offset from them as in the iPad3. Like the A5x the Tegra 3 too seems to require a Heat Sink - the consequences of cramming too many Graphics cores with a 45 nm, non HKMG process perhaps ?
It is a very good piece of hardware, since Google is not revenue centric from hardware, it would be better if they had kept this an open source hardware so that it can be better replicated thought the world.
Good question for this article.
Battery management is big challenge for smartphone or tablet.
My Samsung Galaxy-R can only last for about 5-6 hours if I listening musics,watching moives and using google maps for navigation.
is that $184 BOM estimate based on a 1000 pcs or more BTW ?
its still very good for a £159 for 8GB and £199 for the 16GB version in the UK price, released in retail just as the 2012 Olympics start there.
not to forget there's all that new free Virgin media cable/ wireless underground connectivity now put in place ready for the massive games visitors there too so no problem getting any web content and streaming etc you please with it.
even if the UK goggle shop content isn't great right now as the content providers don't seem to want to take your 2012 Olympics games money and actually pay for their online content there.
oh well the end users will be happy anyway a quad core and you can provide your own content, cant stop the net.
putting a LPDDR2 PoP version on there rather than the better DDR3 would have slowed down the data throughput would it not, so im glad they went DDR3 its still a single channel right ? and so not perfect for gaining extra free speed, at least until the real Wide IO ram makes an appearance.