Breaking News
News & Analysis

Cisco packs silicon photonics on 3-D ICs

Cisco on SDN and power
1/29/2013 02:10 AM EST
16 comments
NO RATINGS
< Previous Page 2 / 2
More Related Links
View Comments: Newest First | Oldest First | Threaded View
<<   <   Page 2 / 2
docdivakar
User Rank
Manager
re: Cisco packs silicon photonics on 3-D ICs
docdivakar   1/29/2013 7:27:17 PM
NO RATINGS
Rick, the title is somewhat misleading... I think Mr. Swift was referring to planar Si optical waveguides. Using these in 3D optical interconnect, from today's on-chip optical interconnect technology, is still far away from fruition from a practical view point. Last year's DesignCon I think there was a talk by HP Lab's chief about this but it has remained largely as a research project. There is no doubt that this is the next growth area for transistors. Underwhelming SDN/OpenFlow by Cisco is not surprising because it is a disruptor to their legacy products! For those interested, here is the link to presentations from Silicon Valley Comsoc on SDN's by Guru Parulkar & Dan Pitt of Open Networking Research Center: http://ewh.ieee.org/r6/scv/comsoc/ComSoc_2012_Presentations.php MP Divakar

a.sun
User Rank
Rookie
re: Cisco packs silicon photonics on 3-D ICs
a.sun   1/29/2013 7:25:23 PM
NO RATINGS
The laser is made of InP by bonding a 2-4" InP wafer onto a 6-8" Si wafer (the size mismatch is an issue!) and thinning down the InP wafer to a few micrometers for later planar processing steps. As far as I know, Intel's solution uses separate CMOS TIA & laser driver chips in addition to a Si photonics chip (including functions of photo detection, modulation and optical routing) in comparison to a more integrated solution from Luxtera.

a.sun
User Rank
Rookie
re: Cisco packs silicon photonics on 3-D ICs
a.sun   1/29/2013 7:24:35 PM
NO RATINGS
The laser is made of InP by bonding a 2-4" InP wafer onto a 6-8" Si wafer (the size mismatch is an issue!) and thinning down the InP wafer to a few micrometers for later planar processing steps. As far as I know, Intel's solution uses separate CMOS TIA & laser driver chips in addition to a Si photonics chip (including functions of photo detection, modulation and optical routing) in comparison to a more integrated solution from Luxtera.

HS_SemiPro
User Rank
CEO
re: Cisco packs silicon photonics on 3-D ICs
HS_SemiPro   1/29/2013 6:37:11 AM
NO RATINGS
That's the beauty of 2.5D and full 3D designs, greatly reduce system cost improve signal latency

rick merritt
User Rank
Author
re: Cisco packs silicon photonics on 3-D ICs
rick merritt   1/29/2013 6:07:37 AM
NO RATINGS
But not as much resistance as an off-chip design ;-)

resistion
User Rank
CEO
re: Cisco packs silicon photonics on 3-D ICs
resistion   1/29/2013 4:13:20 AM
NO RATINGS
The lasers are still non-Si; they are probably InP or the like at the very least. So it looks like interposers will replace motherboards? That's pretty disruptive. Expect some resistance.

<<   <   Page 2 / 2
Flash Poll
Radio
LATEST ARCHIVED BROADCAST
EE Times editor Junko Yoshida grills two executives --Rick Walker, senior product marketing manager for IoT and home automation for CSR, and Jim Reich, CTO and co-founder at Palatehome.
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed