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Intel to Customize High-End Processors
11/20/2013

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Intel has already integrated onto its CPUs math coprocessors, memory controllers, graphics, I/O controllers, and now in-package memory with Knights Landing. Next will be high-speed switches, optical fabrics, next-generation storage, and 3D stacked memory CPUs. (Source: Intel)
Intel has already integrated onto its CPUs math coprocessors, memory controllers, graphics, I/O controllers, and now in-package memory with Knights Landing. Next will be high-speed switches, optical fabrics, next-generation storage, and 3D stacked memory CPUs.
(Source: Intel)

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R_Colin_Johnson
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Re: Knights Landing in 14nm
R_Colin_Johnson   11/20/2013 11:15:41 AM
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I asked them specifically if they would use a 2.5-D silicon interposer, but all they would say is that it will be "high bandwidth".

rick merritt
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Re: Knights Landing in 14nm
rick merritt   11/20/2013 11:12:58 AM
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It will be interesting to see if Intel uses the 2.5-D approach Xilinx pioneered or...

R_Colin_Johnson
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Knights Landing in 14nm
R_Colin_Johnson   11/20/2013 10:40:07 AM
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One thing I forgot to mention is that the next-generation Xeon Phi will be implemented in Intel's 14-nanometer process technology--which should shrink the die even though the whole package may stay the same size or even grow depending on how many memory die are added is alongside the processor.

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