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8|24|2016 CUPERTINO, Calif. — IBM’s Power 9 processor, described for the first time at Hot Chips yesterday, could become a break out chip, seeding new OEM and ...

8|24|2016 CUPERTINO, Calif. – On paper, Zen looks like the kind of core that could drive Advanced Micro Devices to a comeback in PC microprocessors. The part that ...

8|23|2016 LAKE WALES, Fla. — The Moscow Institute of Physics and Technology (MIPT) is probing cutting edge diamond technologies to emit single photons (for ...

8|23|2016 CUPERTINO, Calif. — Microsoft gave the first peek inside the custom vision processor it designed for its HoloLens augmented reality headset. The chip ...

8|23|2016 MADISON, Wis. — The Japanese economic newspaper Nikkei, reported early Monday that Renesas Electronics is “in the final stages of negotiations to ...

8|22|2016 CUPERTINO, Calif. – ARM has developed vector instructions to propel its 64-bit V8 architecture into high-performance computing. Fujitsu helped develop the ...

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Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
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Opinion
Are you an embedded designer who has only ever created systems using microcontrollers (MCUs)? Have you heard about programmable devices in the form of field-programmable ...
The most impressive demo I saw on this week when the 2016 Intel Developer Forum is wrapping up came from Intel’s competitor Advanced Micro Devices at an event ...
Intel Custom Foundry has made a statement of intent that it is serious about competing with the likes of TSMC, Samsung and Globalfoundries by agreeing a full support ...
Traditional functional partitions and expertise domains -- such as circuit design, layout design, and verification -- are rapidly blurring. The ability of developers to ...
Recently, I've been writing a series of articles on the benefits of using hardware emulation for verifying networking system-on-chip (SoC) designs ahead of silicon ...
Over the next year, volumes for fan-out wafer level packages (FO-WLPs) will be driven by application processors, RF transceivers and switches, power management integrated ...
As the automotive market for electronics continues to expand and the volume of automobiles being manufactured increases, there is a growing need for tailored semiconductor ...

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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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