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3|24|2017 SAN FRANCISCO—Intel Corp. announced it would merge all of its artificial intelligence (AI) efforts into a single cross-company organization headed by ...

3|23|2017 SAN JOSE, Calif. — Traditional semiconductor scaling is expected to reach an end by about 2024, according to a white paper from engineers working on a new ...

3|23|2017 SAN FRANCISCO—Specialty foundry TowerJazz Thursday (March 23) rolled out a silicon photonic (SiPho) process to complement its silicon-germanium (SiGe) ...

3|23|2017 SAN JOSE — Electronic and optical components are destined to merge, but the annual OFC event revived the debate over whether silicon photonics (SiP) or ...

3|22|2017 INDIANAPOLIS — Samsung appears to be about a quarter ahead of Taiwan Semiconductor Manufacturing Co. (TSMC) with the ramp of 10-nm process technology, ...

3|22|2017 INDIANAPOLIS — Taiwan Semiconductor Manufacturing Co. (TSMC) and other Asian tech firms may contribute to a rising tide of investment in the U.S. in ...

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On Monday, March 27, the Supreme Court will hear oral arguments in TC Heartland v. Kraft Foods.  The issues in the case are obscure, concerning old cases and ...
I cannot tell you how much I'm looking forward to the forthcoming Embedded Systems Conference (ESC), which will take place in Boston, May 3-4, 2017.
I'm constantly amazed by the wide range of people I meet through LinkedIn. Just the other day, for example, following a contact via LinkedIn, I ended up chatting with ...
In an earlier column -- Digital Data Storage is Undergoing Mind-Boggling Growth -- we considered the mind-boggling growth of electronic data, which exceeded 10,000 ...
Eeek! As I pen these words, there are just over six weeks remaining before the first Embedded Systems Conference (ESC) of the year, which is to be held 3-4 May, 2017, in ...
They don't call it the "Internet of Everything" for nothing. These days, almost every product is eligible to become part of the Internet of Things ...
As part of a new wave of technology enablement, objects like door locks, wearable devices, and heavy machinery are all being hooked up to the internet ...
As contract manufacturers move beyond processes such as wire bonding to bumping, they are starting to buy equipment used in wafer fabs. The shift is motivating some ...

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