Education & Training

Technical Papers Spotlight

Client-side Challenges of M2M-enabled Updates for Mobile Embedded Systems

Accurate BER Tests Start with Instrument-Quality Waveforms

It's Easy to Protect Your Embedded System from Theft

A Thousand Business Ecosystems, a Worldwide Connected Community, and the Future: Chapter 1

The 4th generation Intel Core processors

Use of Thin-Film Thermoelectrics in PCR Thermal Cycling

How to Select the Best Audio Amplifier for Your Design

Ensure Long Lifetimes from Electrolytic Capacitors: a Case Study in LED Light Bulbs

How to Choose the Right Sensor for Your Measurement System

Troubleshooting EMI in Embedded Designs

Putting FPGAs to Work in Software Radio Systems, 7th Edition

Anywhere, Anytime Video Using the H.264 Specification

Advanced Signal Analysis using the History Mode of the RTO Oscilloscope

FPGA-Adaptive Software Debug and Performance Analysis

Shock and Vibration Testing of the SA.45s Chip Scale Atomic Clock (CSAC) Validation Build Units

Synchronization for Next Generation Networks: The PTP Telecom Profile

Smarter Ways to Use Intelligent Systems

Spectrum Analyzer Fundamentals: Theory and Operation of Modern Spectrum Analyzers

Pros and Cons of Consolidating Frequency Sources Using Oscillators and Clock Generators

Configurable Mixed Signal Integration

Technical Papers

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Tech Paper Title	Type	Date
Role of Sockets in IC Product Life Cycle Ironwood Electronics	White Paper	5/8/2013
BGA Socket with Heatsink for High Power Devices Ironwood Electronics	White Paper	4/1/2013
BGA Socket Considerations: Prototype to Reality Ironwood Electronics	White Paper	4/1/2013
Optimizing Insertion Extraction Force in a Pin-Socket Interconnect Ironwood Electronics	White Paper	4/1/2013
Methodical Socket Selection Speeds up Time-to-Market for IC Development Projects Ironwood Electronics	White Paper	4/1/2013
IC Socket Footprint: Why is it important? Ironwood Electronics	White Paper	7/1/2012
DOE relates Spring Probe Variables to Signal Integrity Ironwood Electronics	White Paper	12/2/2010
Package Converter Compliments Chip Obsolescence Ironwood Electronics	White Paper	6/22/2010
Enhanced interconnect medium simplifies test and verification Ironwood Electronics	White Paper	6/22/2010
3D IC Development Needs Innovative Socket Solution Ironwood Electronics	White Paper	6/1/2010
Achieving GHz Speed in Socketed BGA Devices Ironwood Electronics	White Paper	2/25/2010
Benefits of Signal Integrity (SI) Simulation for High Speed Socket and Adapter Design Ironwood Electronics	White Paper	9/4/2009
IC Interconnects for the Life of Your Product Ironwood Electronics	White Paper	4/30/2009
Adapters and Sockets for Product Life-Cycle Management: Extending the Life of Your Product Ironwood Electronics	White Paper	2/23/2005
Not all ISO 9001:2000 certifications are alike Ironwood Electronics	White Paper	8/12/2004

1 - 15 of 15

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All papers are reviewed by EE Times staff. If approved for posting, we'll send you a link as to where the paper can be found on the site. All papers must be technical in nature; Press releases, Product announcements, PowerPoint presentations, pamphlets, incomplete documents/abstracts will not be accepted. For more information, contact Emily Soucy.