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Best of the web -– June 15th
Brian Bailey
6/15/2012 10:43 AM EDT
This weekly posting provides a condensation of some of the best EDA and IP blogs from the web over the past week. If you have a blog feed that you would like me to consider, please let me know and I will include it in future editions.
This week’s winner is:
What can I say. Richard Goering may not be employed by any specific publication house, but he is, in my opinion, still the best journalist in the industry. This week he put out four great DAC coverage pieces. My hat is off to him!
DAC 2012: Multi-Core Performance Growth Slowing, New Approaches Needed
Provides a synopsis of Joshua Friedrich’s DAC keynote
DAC 2012: How Unified Coverage Interoperability Standard (UCIS) Will Ease IC Verification
DAC 2012 Panelists: How to Succeed at 28nm, 20nm and 14nm
DAC 2012 Panelists Tackle Tough Questions About 2.5D-ICs and 3D-ICs
Other good blogs, papers and articles include:
28nm is fabulous for Xilinx, says Gavrielov – David Manners
A discussion about some of the decisions made and how it has affected the product
3D Architecture Implementation: A Survey - M. H. Jabbar, D. Houzet GIPSA Lab, Grenoble INP, France
Discusses problems associated with 3D and some example chips.
Degrees of freedom for finFETs – Chris Edwards
Talks about the VLSI conference in Hawaii
From devices to systems: Intel’s projections for the future – Chris Edwards
The big news in telematics – John Day ponders on the updates from Telematics Update Detroit if it were to happen today.
Brian Bailey – keeping you covered
If you found this article to be of interest, visit EDA Designline where you will find the latest and greatest design, technology, product, and news articles with regard to all aspects of Electronic Design Automation (EDA).
Also, you can obtain a highlights update delivered directly to your inbox by signing up for the EDA Designline weekly newsletter – just Click Here to request this newsletter using the Manage Newsletters tab (if you aren't already a member you'll be asked to register, but it's free and painless so don't let that stop you).
This week’s winner is:
What can I say. Richard Goering may not be employed by any specific publication house, but he is, in my opinion, still the best journalist in the industry. This week he put out four great DAC coverage pieces. My hat is off to him!
DAC 2012: Multi-Core Performance Growth Slowing, New Approaches Needed
Provides a synopsis of Joshua Friedrich’s DAC keynote
DAC 2012: How Unified Coverage Interoperability Standard (UCIS) Will Ease IC Verification
DAC 2012 Panelists: How to Succeed at 28nm, 20nm and 14nm
DAC 2012 Panelists Tackle Tough Questions About 2.5D-ICs and 3D-ICs
Other good blogs, papers and articles include:
28nm is fabulous for Xilinx, says Gavrielov – David Manners
A discussion about some of the decisions made and how it has affected the product
3D Architecture Implementation: A Survey - M. H. Jabbar, D. Houzet GIPSA Lab, Grenoble INP, France
Discusses problems associated with 3D and some example chips.
Degrees of freedom for finFETs – Chris Edwards
Talks about the VLSI conference in Hawaii
From devices to systems: Intel’s projections for the future – Chris Edwards
The big news in telematics – John Day ponders on the updates from Telematics Update Detroit if it were to happen today.
Brian Bailey – keeping you covered
If you found this article to be of interest, visit EDA Designline where you will find the latest and greatest design, technology, product, and news articles with regard to all aspects of Electronic Design Automation (EDA).
Also, you can obtain a highlights update delivered directly to your inbox by signing up for the EDA Designline weekly newsletter – just Click Here to request this newsletter using the Manage Newsletters tab (if you aren't already a member you'll be asked to register, but it's free and painless so don't let that stop you).
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