BeTheSignal
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iniewski
@Lexk, great, thanx, what's you phone number?...perhaps you will be interested ...
Lexk
Kris, we'd be happy to show you Shocking Technologies material in action. Please ...
Sanmina-SCI aims for transparent interconnects
Eric Bogatin
11/18/2010 2:09 PM EST
Page 3
Yet another alternative approach to engineer the “transparent via” is to adjust the more than a dozen specific design features of a via to reduce its impact on the signal. These include features such as the non functional pads, the length of the residual stubs, the clearance holes, spacing between the vias, capture pads and even the shape of the traces feeding the vias. The challenge is exploring this entire design space to find a high volume production capable design.
The solution is an algorithm Sanmina-SCI created to efficiently explore design space to find the optimize combination of features to approximate a transparent via. The result is Opti-vias, which leverage all the options in the Sanmina tool box.
Of course, the dielectric losses from laminate materials and conductor losses from rough copper play a significant role in backplane performance. But, it’s not just about the materials. There are many design factors that also contribute to line loss.
Next: Page 4
Yet another alternative approach to engineer the “transparent via” is to adjust the more than a dozen specific design features of a via to reduce its impact on the signal. These include features such as the non functional pads, the length of the residual stubs, the clearance holes, spacing between the vias, capture pads and even the shape of the traces feeding the vias. The challenge is exploring this entire design space to find a high volume production capable design.
The solution is an algorithm Sanmina-SCI created to efficiently explore design space to find the optimize combination of features to approximate a transparent via. The result is Opti-vias, which leverage all the options in the Sanmina tool box.
Of course, the dielectric losses from laminate materials and conductor losses from rough copper play a significant role in backplane performance. But, it’s not just about the materials. There are many design factors that also contribute to line loss.
“At the end of the day it’s all about what the signal sees. What
influences the eye pattern is the performance of that net on that board
and a large part of it is the total attenuation of that net, not just
the Df or the copper losses. The design choices, based on specific
assumed values of Dk and Df also influence the final performance.”
Figure 3. 6 Gbps eye comparing conventional long stub and terminated stub, courtesy of Sanmina-SCI
Next: Page 4
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iniewski
11/19/2010 6:41 PM EST
Very interesting, almost shocking ;-), embedded ESD protection by Shocking Technologies...although I was a little puzzled by the wording in the artcile: "plans to solve"...is this for real? has anyone beyond Sanmina's trying to accomplish this feat with this "switchable dielectric material"...Kris
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Lexk
11/23/2010 1:48 AM EST
Kris, we'd be happy to show you Shocking Technologies material in action. Please feel free to check us out at www.shockingtech.com or give me a call. Lex Kosowsky-President & CEO Shocking Technologies
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iniewski
11/24/2010 4:01 PM EST
@Lexk, great, thanx, what's you phone number?...perhaps you will be interested in showing your technology at emerging technology meeting in Whistler in 2011? details at www.cmoset.com, Kris
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