This is a roundup of news or activities in the past few days that may be of interest to people. Freescale Semiconductor
has revealed its first RF power amplifier product built using gallium nitride (GaN) technology. The company’s RF power GaN products will initially target the cellular infrastructure market. The AFG25HW355S device is a 350W, high-performance-in-package (HiP), 2:1 asymmetric device. Advantages of using GaN technology in power amplifiers include smaller product form factors, low parasitic loss, elevated power density and higher-frequency operation.GEO Semiconductor
, a company involved with programmable geometric processor (eWarp) IC solutions has announced that it has secured $3 million in debt financing, which converts into Series B equity when a certain threshold is achieved. The Company is focused on completing $7+ million of Series B funding, signing additional strategic partners and completing the development of its next generation eWarp IC. GEO plans to utilize the proceeds from the Series B financing to complete the development of its new GEN 4 eWARP processor, which is expected to tape-out in the third quarter of 2012. STMicroelectronics
announces that GLOBALFOUNDRIES
has agreed to manufacture devices for ST using ST’s proprietary Fully Depleted Silicon-on-Insulator (FD-SOI) technology in both the 28nm and 20nm nodes. The 28nm FD-SOI generation, currently in the industrialization phase, is scheduled to be available for prototyping by July 2012 and the next node, the 20nm FD-SOI generation, is currently under development and is scheduled to be ready for prototyping by Q3 2013.Altera
has released the latest version of its Quartus II development software. Quartus II software version 12.0 provides additional productivity and performance advantages, such as up to 4X faster compile times for high-performance 28-nm designs. Additional upgrades include broadened 28-nm device support, including initial support for Altera’s SoC FPGAs, enhanced Qsys system integration and DSP Builder tools, and improved intellectual property (IP) core offerings.SEMI
has reported that worldwide semiconductor manufacturing equipment billings reached US$ 10.61 billion in the first quarter of 2012. The billings figure is 14 percent higher than the fourth quarter of 2011 and 9 percent lower higher than the same quarter a year ago. Worldwide semiconductor equipment bookings were $10.07 billion in the first quarter of 2012. The figure is 9 percent lower than the same quarter a year ago and 13 percent higher than the bookings figure for the fourth quarter of 2011.Brian Bailey
– keeping you covered
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