Intel to reduce lead-content in chips by 95%

Intel executives also indicated the company intends to label the reduced-lead microprocessors as "lead-free" beginning with some microprocessors and chip sets in the third quarter. The label would apply to embedded processors in second quarter.

Intel is using new packages that use lead-free solder balls. The company said it is trying to find a reliable solution for the tiny amount of lead still needed inside the processor packaging to connect the actual silicon "core" to the package.

Since 2000, Intel has been working with industry consortia and the European Union's Restriction of Hazardous Substances committee to devise a solution that can be used globally.

"Intel shipped millions of lead-free flash memory components in 2003. Today's announcement is the next major step on the road to a lead-free product line for Intel's high volume CPU and chipset product lines," said Nasser Grayeli, Intel vice president and director of assembly technology development, technology and manufacturing group.