LONDON Three-dimensional packaging company Ziptronix Inc. has said it has secured $7.2 million in growth capital through a Series C venture capital investment.
Ziptronix (Morrisville, North Carolina) is commercializing three-dimensional integrated circuit (3D IC) semiconductor technology, and has been backed by previous investors, including Alliance Technology Ventures, Grotech Capital, Intersouth Partners, Research Technology Ventures, RTI International and NC IDEA.
Ziptronix said the money would be used to expand sales and marketing initiatives and to develop additional partnerships. Ziptronix announced a development and marketing partnership with Tezzaron Semiconductor Corp. in February 2005. Ziptronix provides conductive-dielectric, covalent bonding of semiconductor materials, and other 3D IC technology. These technologies enable three-dimensional vertical integration of two-dimensional integrated circuits.
“Ziptronix continues to be an exciting investment opportunity,” said Mitch Mumma of Intersouth Partners, in a statement issued by Ziptronix. “The company continues to make progress in advancing its technology and the management team is highly focused on getting to the next level of customer traction and revenue generation.”