News & Analysis
TSMC, Dialog team on process for power management ICs
Peter Clarke
2/23/2010 5:32 AM EST
LONDON — Power management chip vendor Dialog Semiconductor plc (Kirchheim-unter-Teck, Germany) has announced it is working with foundry partner Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) on a bipolar-CMOS-DMOS (BCD) manufacturing process technology tailored to power management ICs for portable devices.
The process has 0.25-micron minimum geometry and a range of proprietary IP blocks, based on TSMC's 0.25-micron BCD process nodes, have already been developed for incorporation into Dialog's next-generation PMICs, with the first devices already available.
"Close collaboration of our innovative technology with foundry partners is key to Dialog's strategic business model, which accelerates the development of the highest level of power management integration in the industry," said Jalal Bagherli, CEO of Dialog Semiconductor, in a statement.
Related links and articles:
Dialog acquires power management technology from Zetex
Microsemi partners with MagnaChip on process technology
Xilinx confirms: TSMC in, UMC out at 28-nm
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