TSMC's R&D boss addresses 40-nm yields, high-k, litho

5. Plans for 22-nm node

(In the past, TSMC has talked about the 22-nm node.)

Chiang: ''Going forward, we plan to introduce 22 nanometer node about two years after we introduce 28 nanometer, so the first introduction we'd like to be in the Q3 of 2012, and this if for the high performance version. And followed by the low power version about the end of Q1 2013.

Going to 22 nanometer and beyond, as we like for a new module to be introduced, in 20, 22 nanometer, the first will be we go to the second generation high-k metal gate.''

6. Litho directions

(TSMC has inserted 193-nm immersion and is looking at EUV and maskless.)

''We will continue using the 193 immersion with double patterning in the early stage, and we will migrate to EUV or multiple e-beam direct write if one of these technologies can be more mature and more cost effective.

And lithography side the industry seems like the mainstream trend will be to go to EUV and you may or may not have heard about the cost of EUV. If you buy one EUV tool with a matched track, it will cost like 80 million dollars for just one tool. I was shocked to sign a P.O. only couple weeks ago shortly before my vacation. I signed a 1.9 million euro purchase order for a clamp.

This clamp is a custom made clamp only for EUV. We have to mount a special clamp on the ceiling and this clamp will be used to lift the EUV tool when we install the machine, and when we do the maintenance. This tool is so heavy, no other tool can lift it up, and this custom-made clamp costs us 1.9 million euros, just to buy a clamp. It's really shocking.''