News & Analysis
FPGA startup: Process tech eases ASIC migration
Dylan McGrath
3/10/2010 11:01 AM EST
Like Tabula, Tier Logic's technology depends on a three-dimensional structure. But while Tabula uses rapid reconfiguration to, in the words of that firm's executives, treat time as the third dimension, Tier Logic's approach separates user circuits and configuration circuits into 3-D stacked layers, creating what the company calls the world's first monolithic 3-D FPGA.
The key is that Tier Logic's 3-D TierFPGA features one level, or tier, of thin-film transistor (TFT)-based SRAM, creating a more efficient device than a traditional 2-D FPGA, a large percentage of which is configuration SRAM, according to Paul Hollingworth, a 23-year-veteran of the chip industry who serves as Tier Logic's vice president of sales and marketing.
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| Tier Logic's FPGA's are converted to ASICs by replacing the TFT SRAM top layer containing the programmable configuration circuitry with a simple metal layer, retaining the identical timing, according to the company. |
But the biggest advantage of the device's structure is that it enables TierFPGAs to be converted to ASICs relatively quickly and painlessly by simply replacing the TFT SRAM with metal, according to Hollingworth. A former head of Altera Corp.'s HardCopy product line, Hollingworth said he joined Tier Logic because he recognized the potential of the technology to be "what HardCopy was supposed to be." While converting an FPGA to a HardCopy ASIC requires significant changes to the timing of a design, a TierFPGA can be converted to a TierASIC "much more seamlessly," according to Hollingworth.
Unlike any other type of ASIC conversion, the Tier Logic timing remains identical between the FPGA and ASIC, allowing zero-risk, zero-effort conversions, Hollingworth said. He said the company's "design once approach" delivers same-die silicon with identical functionality and timing for both FPGA and ASIC products.
Tier Logic was founded in 2003 Raminda Madurawe and Peter Suaris, veterans of Altera and Mentor Graphics Corp., respectively, according to the company. The company received seed funding in 2005. In 2007, the company announced it received Series A funding from investors Matrix Partners and Walden International. The company is headquartered in Santa Clara, Calif., but has about half of its employees in Colombo, Sri Lanka, the native country of Madurawe and Suaris.
TierFPGAs claim greater gate density compared to competing FPGAs by virtue of the 3-D architecture and higher logic efficiency from greater configurability, according to Hollingworth.
In terms of cost per density, TierFPGAs cost more than 50 percent less than high-end 2-D FPGAs and 20 percent less than low-end 2-D FPGAs, according to Hollingworth. Converting designs to TierASICs lowers costs by another 50 percent and costs less than $50,000 in non-reoccurring engineering costs, Hollingworth said.
Compared with a conventional approach, where converting an FPGA design to an ASIC requires a complete re-design and takes nine to 12 months, converting from TierFPGA to TierASIC takes only about four weeks, Hollingworth said.





Sundar Srinivasan
3/11/2010 10:03 AM EST
Good article. And some very good point by Richard J. In starting up these companies, the main challenge would be to keep the current CAD flow as such and produce better results. That requires development in each and every phase of CAD flow as mentioned here: http://sunnyeves.blogspot.com/2010/03/compiling-extra-dimension.html
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tpfj
3/11/2010 1:48 PM EST
I love these unsubstantiated marketing statements: "where converting an FPGA design to an ASIC requires a complete re-design and takes nine to 12 months, converting from TierFPGA to TierASIC takes only about four weeks".
I'm pretty sure 9-12 months is completely wrong. All projects I've worked on its been next day, if ASIC was the end goal and FPGA was the proving ground.
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G_Koss
3/11/2010 2:21 PM EST
So it's easy to convert to an ASIC? Pray tell, if the configuration RAM is missing, then how do you test all the signal paths in the device? Modern deep submicron ASIC's suffer from doping and oxide thickness variations that can produce wild swings in transistor drive strength even on the same die. FPGA's with full configuration logic test for this, and failing devices are culled. Without configuration RAM, the "Hardcopy" devices will need register scan chains, and the whole panopoly of ASIC test hardware.. about a 30% overhead on the basic logic. Don't believe for a second you can fully test a device just from test vectors on the input pins. Testing will be a major issue on the devices that lack configuration RAM.
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Jagdish Bisawa
7/24/2010 2:36 PM EDT
The technology TierLogic adopted was more suitable for applications that required fast & seamless conversion from an SRAM-based FPGA to an ASIC. If you look at the reconfigurable logic market, a lot of business comes from the SoC, semi-asic, application areas that enable the usage of such devices in areas like automotive entertainment & consumer appliances.
A fast conversion to ASIC might not be the need of the day, & hence investors stayed away from such a venture. Had it been something that added innovation to the existing FPGA technologies ( like the one done by Actel a few years ago ), the situation would have been different.
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