Mitsubishi agrees to use Infineon IGBT package

LONDON — Infineon Technologies AG (Munich, Germany) and Mitsubishi Electric Corp. of Japan have agreed they will both serve the industrial motion controls and drives market worldwide as sources for advanced IGBT modules packaged in SmartPACKs and SmartPIMs.

The packages were developed by Infineon and will be available with the latest generation of power chip technologies from the two companies, Infineon said.

Under this agreement, Mitsubishi Electric will market its power chips of various ratings from 15- up to 150-amps and voltage classes from 600- to 1200-volts in the Smart-1,-2 and -3 housings of Infineon. Infineon will continue to manufacture and supply the same range of fully compatible products using its own chip technologies and module manufacturing.

Users of SmartPACK and SmartPIM will now benefit from package-compatible IGBT [insulated gate bipolar transistor] modules from two sources, Infineon said.

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