Boin to expand data analysis efforts in metrology

TOMERDINGEN, Germany--Boin GmbH, a software supplier for the semiconductor industry, has partnered with yieldPower Semiconductor Software to extend the breadth of test data analysis and related functions for wafer metrology.

Boin offers the Wafermap software product line, which analyzes and visualizes data files from metrology tools used in wafer fabs. The Tomerdingen-based company plans to endorse yieldPower's software, which is used to do statistical test data analysis on lot data from semiconductor IC production. yieldPower's product supports standard test data formats such as STDF and ATDF.

"The alliance with yieldPower extends Wafermap's position as the premier tool to analyze and visualize semiconductor data in wafer fabrication and testing," said Manuela Boin, co-founder and general manager of Boin, in a statement.

"yieldPower Semiconductor Software enables test and product engineers to perform fast characterization and yield analysis, gives them the tool to monitor production data and maximize yield," said Omar Malik, chief executive of yieldPower of Dallas, in a statement.

"Our software allows test engineers to drill down into die level results, and do wafer map comparisons by quartiles to judge defects. Our alliance with Wafermap will strengthen the breadth of functionality we can offer our clients," he said.