News & Analysis
Matrix migrates 3D PROM to 0.15-micron process
Peter Clarke
11/8/2004 8:57 AM EST
Matrix has been shipping an eight-layer antifuse-based 512-Mbit PROM made using a 0.25-micron manufacturing process for about one year. The company added that it has shipped one million units of 3DM in fewer than four months of mass production.
However, the company did not disclose whether the move to 0.15-micron manufacturing process was a simple shrink of the previous die, nor whether the company had changed the number of layers of memory in the design, nor whether it had made other design changes. Matrix did say the 3DM was manufactured at Taiwan Semiconductor Manufacturing Co. Ltd. and packaged and tested at Amkor. Matrix said that the maximum capacity available was still 512-Mbit.
"Since Matrix's unique three-dimensional approach uses well-understood techniques in new and innovative ways, the company's road to production has been smoother than that of many other groundbreaking technologies. Today, Matrix is well-positioned to penetrate the mask ROM market, and we expect to see it make inroads into other nonvolatile areas further on." said Jim Handy, director of nonvolatile memory research at Semico Research, in a statement issued by Matrix.
"By targeting Matrix 3DM at content publishing for mobile devices, we aim to do for portable devices what the PC CD-ROM did for multimedia content distribution in the early 1990's — offering a convenient, cost-effective, standards-compatible, way to deliver and share content for portable audio-video players, portable games, advanced toys, mobile phones, and handheld computers," said Dennis Segers, president and chief executive officer of Matrix Semiconductor, in a statement.
Matrix, heavily backed with venture capital investment, was included in the first and the second iteration of the Silicon Strategies' 60 Emerging Startups list.
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