News & Analysis
NXP starts sale of Caen fab
Anne-Francoise Pele
10/29/2008 12:14 PM EDT
In September, NXP BV (Eindhoven, the Netherlands), the chip company formed by a spin-off from Royal Philips Electronics, unveiled a major restructuring plan that is expected to cost about
At the time of the announcement, Frans van Houten, president and CEO of NXP, said NXP intended to close a fab in East Fishkill, New York, in 2009 and close the ICN5 portion of Nijmegen and the ICH part of NXP's Hamburg facility in 2010. In addition, NXP expressed its intention to sell off or close a pilot fab in Caen in 2009.
Early October, NXP appointed ATREG to sell its 200 mm semiconductor manufacturing facility in Fishkill.
As for Caen manufacturing facility, NXP said the offering includes a full array of proven patents and IP, the existing business and technology development team and the R&D excellence center. The IP and patents center around integrated passive device (Passive Integrated Circuits) products that have direct applicability with cell phones, handheld devices but also professional devices to bring performance, miniaturization and IP protection as well as cost reduction.
Commenting on the announcement, Jean-Yves Muller, vice president and general manager of NXP Semiconductors France, declared: "NXP selected Stephen Rothrock and Doug Barrett of ATREG to assist us with the Caen offering as we have with our East Fishkill offering. We feel they are uniquely qualified to help us capitalize on the global interest we have experienced since our announcement."
He added: "NXP realizes the unique value proposition of the Caen offering and what this business could provide in terms of long-term revenue to a purchaser."
Mid-October, Jean-Yves Muller succeeded to Henri-Alain Rault at the head of NXP France. Rault decided to leave his position saying that he did not want to end his carreer with another restructuring plan.
The company's facility in Caen currently employs


