News & Analysis
Intel outlines ultra-thin future
John Walko
6/2/2009 8:34 AM EDT
The SU2700 consumer ultra-low voltage (CULV) processor unveiled at Computex is the first of Intel's dual-core CULV chips to fall under the Pentium rather than the Core 2 Duo brand.
The part is firmly targeted ultra-thin laptops that are slightly more expensive and powerful than netbooks, but still have portability that is closer to netbooks than to current laptops.
The 1.3GHz SU2700 uses an 800MHz front-side bus and 2MB of L2 cache. The chip is manufactured using the 45nm process. It has a thermal design power (TDP) — a measure for the amount of cooling a processor needs — of 10W, or around a third of the TDP for most current notebook processors.
The closest competitor to the CULV chip range is AMD's Athlon Neo product line. AMD also made its own processor announcement at the trade-show saying it has started shipping the dual-core versions of these ultra-low voltage chips.
Intel also outlined its GS40 Express chipset for CULV laptops. The part – a lower-power variant of the existing GS45 Express -- allows high-definition video playback and includes an HDMI output.
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