News & Analysis

Betting on the Next Silicon Boom

Jim Lipman

7/17/2003 12:00 AM EDT

A two-year-plus slump has seriously hamstrung the economic viability of the semiconductor industry. According to Gartner Dataquest, the worldwide semiconductor market dropped 31.2 percent in 2001 compared to 2000, a record plunge, and grew only 1.9 percent in 2002. While positive, Gartner Dataquest's semiconductor growth forecast for 2003 is only 8.3%, nothing to write home about. For next year, growth is predicted to be a more healthy 23.1%.

Chip manufacturers are looking to identify the next big silicon-fueled high-growth market. Companies that choose correctly stand to leapfrog their competitors as the electronics industry starts to turnaround.

Choose Wisely
The penalty for incorrectly picking a silicon boom can be devastating. For example, National Semiconductor put a large amount of time and money into developing and marketing Geode, an SoC processor targeting low-cost Internet appliances. However, the projected high-growth Internet-appliance market never developed, PC prices dropped, and National bet on an X86 core for Geode, which itself was a bad decision. Development of a single SoC can run into tens of millions of dollars and also diverts development and marketing resources from other potentially profitable product-development programs. While this is damaging to a large company, very much so for National, it can be disastrous for a small or medium-sized chip company.

In this article, several semiconductor leaders share their thoughts on what they think the next silicon winners will be and why.

Processing and Communications Co-Existing
Richard Tobias, VP of the Toshiba America's Electronic Components (TAEC) ASIC and Foundry Business Unit, laments the lack of significant innovations on the horizon on which to build new markets. However, Tobias indicates that shrinking processing nodes—90 nm today and 65 nm by Christmas of 2005 for Toshiba—will allow chips to contain up to 30 million gates by 2007. He sees such chips comprising heavy processing capability along with high-speed serial communications to move data around the chip as well as on and off to other portions of the overall system. For programming and data storage, Flash memory will be a hot commodity for future applications.

 
For more information on SiP technology, check out System-in-Package Technology, Application, and Trends.
 
According to Tobias, one key will be innovative system-in-package (SiP) technology, allowing what would be very large and expensive single chips to be divided into multiple chips in close juxtaposition in a single package. Chip vendors will either have to develop good SiP technology or link up with other companies who have it. Design reuse will be a necessity to deal with ever-shrinking design cycles, so chip companies need to have good access to high-quality silicon IP—again, either their own or from third-party vendors.

Not surprisingly, Tobias considers power consumption an important issue, and not just for portable equipment. A problem with low-power design is the lack of good EDA tools for power analysis and optimization. In fact, at 90 nm Tobias considers the current EDA offerings to be inadequate in general, especially for back-end place-and-route operations.

Tobias does have a vision of how future products will evolve that seems to go against popular opinion—he thinks that, in the near term, there will not be a convergence of the portable appliances you use. In other words, he feels that everyone will still have a laptop (or notebook) computer, digital camera, cell phone, PDA, and so on. Tobias bases his reasoning on the desired form factor of a device. Simply put, it is easier to use a camera when it looks and feels like a camera than when it is embedded into a phone or PDA.

Home Entertainment Will Rule

 
Is UWB Just Around the Corner?

If you're talking about consumer high-definition digital-media applications, UWB is probably on the horizon. If you want to learn about UWB technology and general applicability, there is plenty of literature available on the Internet (for example, see Ultra-Wideband: It's Not Just Hype and Ultra-Wideband Technology for Short- or Medium-Range Wireless Communications). However, UWB will almost assuredly be in the picture for home-entertainment applications—consumers want to be able to handle high-definition video.

802-11b (WiFi) and 802.11g haven't the bandwidth to handle HDTV signals, which need around 35 Mbps support. 802.11a (WiFi-5) has the bandwidth, but uses too much power for handheld-device operation. Another problem with 802.11 technology is that it is an Ethernet derivative for packet-based data-networking applications. This makes 802.11 a poor choice for intensive multimedia applications, since the technology depends on data packets arriving in order and on time.

Furthermore, WiFi-5 NIC cards, at over $100 each, are too expensive for home-entertainment consumer applications. However, at a typical bandwidth of 100 Mbps over a 10-meter range, UWB fits the bill. Since 10 meters is too short for whole-house coverage, look for UWB for intra-room networking with a WiFi backbone supporting the entire home. The 'single room' limitation is one of the reasons that many companies developing UWB-based products are looking for ways to increase this range.

Several companies are working with the IEEE to develop a UWB standard, but nothing will appear until 2H04 at the earliest. Among the issues contributing to the definition of a UWB standard is that of single-band vs. multi-band implementations within the 7.5 GHz band (3.1 to 10.6 GHz) allocated to UWB equipment by the FCC. Potential UWB product vendors are currently developing products with capabilities to increase both bandwidth and range. Look for high-end DSP chips to be a major factor in the development of future UWB products.

 
Also from TAEC, Shardul Kazi, VP of the TX-RISC Business Unit, does not see a PC as a "master controller" in the living room. As Kazi puts it, "we need to liberate the consumer from the PC." Instead, he sees high growth in intelligent home-entertainment systems, which control a home's complete audio and video digital-media flow. For this to happen connectivity is very important, making wireless "throughout the home" an important market. Regarding the various flavors of 802.11, WiFi (802.11b), WiFi-5 (802.11a), and the upcoming 802.11g (an enhanced version of WiFi), he doesn't see any clear winner. However, Kazi does feel the ultra wideband (UWB) technology will be a strong contender for intra-home connectivity—as long as it can successfully compete with 802.11 on price, power, bandwidth, and reliability (see sidebar, Is UWB Just Around the Corner?).

According to Kazi evolving standards require chip reconfigurability, probably via software. He also feels that successful products need to be able to handle several different types of audio and video formats, particularly since the user of these products will want to manipulate as well as play back digital media. Kazi states that power for these living-room applications is not as important as chip integration and the accompanying cost reduction of systems using these chips.

You Are What You Wear
Projecting requirements beyond those expressed by Kazi is his colleague, Farhad Mafie, VP of TAEC's ASSP Business Unit, who describes the concept of "persuasive computing." Mafie feels that consumer devices need to be "more aware of their environment and more intelligent to access available services" (think Tom Cruise in Minority Report). For example, when you enter a department store, the store would 'know' who you are and what you like to be able to tell you about sales and product locations in which you have an interest.

To achieve persuasive computing, Mafie sees wearable computers with wireless capability powered by faster and more flexible processor engines. The computer's silicon will give it capabilities such as true voice and gesture recognition (for multiple persons) to save keystrokes, multi-processing to handle multiple functions, GPS, and lots of Flash memory to handle new programs "on the fly."

SoCMosaic
To support the upcoming applications projected by Tobias and Kazi, last January TAEC introduced SoCMosaic, an ARM 9-based configurable platform targeting low-cost networking and consumer convergence applications. Toshiba sees a use for SoCMosaic in access points, home gateways, SOHO routers, thin-client Internet-capable devices, networked peripherals, multimedia application servers, and multi-channel VoIP phone sets.

SoCMosaic is available as soft silicon IP, RTL code you can synthesize for 180 nm, 130 nm, 90 nm or 65 nm process technologies. The platform, which runs under the Linux OS (with others available on demand), also comprises pre-tested silicon-IP blocks, standardized bus interfaces, an RTL testbench, and high-level, cycle-accurate C models. According to Tobias, SoCMosaic can cut total design time for a customized chip from a typical 18 months to as little as four months.

SoCMosaic contains common peripheral functions such as I/Os, interrupts, counters and serial ports plus the ARM processor. Customers then select silicon IP such as embedded DRAM; system interfaces such as Ethernet, USB, 1394, PCI controllers, and SerDes; and optimized hardware/software application functions such as VoIP, MPEG, and 802.11 (Figure 1). Toshiba also has several analog-IP functions with variants for each block to meet design requirements such as high speed, low power, small area, or low noise.


Figure 1:  SoCMosaic combines several timing and communication cores with an ARM 9 processor, connected via an OCP bus. You customize the SoCMosaic chip by adding additional cores to meet specific application requirements.

The first SoCMosaic platforms will have a single ARM 9 running Linux or another RTOS for low-end networking and consumer applications. A second version of the platform, expected later this year, will support multiple processor cores for high-throughput multimedia and high-end networking applications.

All-in-One
Whereas Toshiba's Tobias sees the concept of separate consumer handheld appliances for different functions existing for awhile, ST Micro's Andrea Cuomo takes an opposing view. Cuomo, ST's Corporate VP of Advanced System Technology, believes that "consumers want everything" and that a single information appliance will evolve to handle video, audio, services, and communication with people and devices. To accomplish this convergence, we will need continuing advances in virtually all phases of system components—silicon, software layers, middleware, and appliance platforms, to name a few. The silicon portion will comprise several technologies, such as SoCs, uPs, and DSPs, but not FPGAs since they are too "power hungry."

Cuomo does not see process technology as a barrier—ST has 90 nm already available with 65 nm in the works. He also feels that wireless bandwidth is not as big an obstacle as suggested by others, since it is only an issue in real time (several applications, such as receiving video, can be done during relatively long time periods and then played back locally in real time). With the increasing functionality of information appliances, Cuomo does sees power as a very big problem that designers must overcome through both software and hardware development. JPEG and other video functions are 'power hogs', and displays also dissipate relatively large amounts of power. He thus sees a need for substantial improvement in battery technology for powering future consumer handheld devices.

Also important, according to Cuomo, is the need for better 'synchronization' between software and hardware designers, service providers, and manufacturers (the supply chain participants). This will most likely require a new business model between silicon, system, service, and manufacturing partners.

Nomadik
ST has taken a step towards supporting Cuomo's view of the all-in-one consumer handheld appliance with Nomadik. Targeting 2.5/3G mobile phones, PDAs, and other wireless terminals, the Nomadik multimedia platform is also ARM 9-enabled and was designed by ST to support voice processing along with multimedia applications. According to ST, the ARM core runs up to 350 MHz in a 130 nm process and up to 500 MHz at 90 nm. Nomadik contains a CMOS sensor interface (for a digital camera) and can encode and decode up to VGA-quality video at 30 fps. Power dissipation is very low—only 20mW with MPEG-4 QCIF (quarter common intermediate format) playback at 15 fps with MP3 audio.

Nomadik uses a distributed-processing architecture to divide the various tasks the platform must handle. Along with an ARM926 core, Nomadik has smart accelerators, low-power CODEC engines that support multiple A/V standards and formats for creating, sending, and receiving images and video clips, as well as audio and video communications (Figure 2). The accelerators operate independently or concurrently with the CPU, depending on task requirements. By handling all A/V functions, including pre- and post-processing, these engines free the ARM CPU for control and program-flow tasks.


Figure 2:  The Nomadik platform combines an ARM 9 core with smart accelerators to handle the coding and decoding of both audio and video signals.

The Nomadik platform supports the OMAPI wireless standard, initially proposed by ST and Texas Instruments late in 2002. The companies' goal with OMAPI is to enhance how multimedia looks and runs on cell phones, PDAs, and other portable appliances. ST and TI based OMAPI on TI's popular OMAP standard, but added a specific set of software and hardware interfaces defining common application peripherals that apply to multimedia applications.

The current version of Nomadik has two smart accelerators for audio and video processing. A C-programmed DSP core powers the audio accelerator while the video accelerator combines software and hardware. Future versions of Nomadik will contain a DSP core and additional smart accelerators for other application-specific functions.

Eliminating the Wall Bond
Proposing going from "everything tied to the wall" to communicating from everywhere is Gene Franz, a Principal Fellow and DSP Business Development Manager of TI's semiconductor group. He sees cell phones and pervasive wireless communications as the next big market for silicon, but with a few caveats. First, Franz would like to see cell phones with voice translators to support true global communications. Second, since the bulk of cell-phone power dissipation is in the communications link, he feels that we need to find a way to lower RF power. Like Toshiba's Kazi, Franz, along with his colleague, Doug Razor, TI's VP and Manager of Worldwide Strategic Marketing, thinks that UWB will play a role in lowering wireless power (according to Rasor, UWB operates on 1/5 the power of today's WLAN technology).

Franz and Rasor believe we need to rethink how we communicate over long distances. Rasor feels that short-range communication, relayed by repeaters and bridges to increase range, may be the way to manage power in handheld communication devices. This communication scenario would take UWB-enabled devices out of the 'in the home only' environment and allow them to communicate with other devices that use current WLAN technology (by FCC decree, you can currently use UWB only indoors or outdoors in handheld devices for peer-to-peer operation) . Rasor also sees future cell-phone operation as a confluence of audio, video, data, and transactions (such as banking and paying bills), making tomorrow's cell phone look much like ST Cuomo's all-in-one consumer appliance.

Frantz also brings out an interesting point that is key to TI's general development efforts. The company seeks to create technology that other companies can then leverage for their own products. This idea helps accelerate the acceptance and use of new technology and products that employ this technology by the end user. Frantz also feels that we need to figure out a way to create the various components (hardware and software) in a system to be able to easily integrate them. In addition, we also need a roadmap for integrating the system towards the goal of a single chip without having to redo the system each step of the way.

Breaking the DSP GigaHertz Barrier
To support upcoming compute-intensive electronic systems, in May of this year TI announced a 1 GHz DSP (TMS320C6416). The chip, sampling later this year and scheduled for production at 90 nm in 2004, will enable systems supporting advanced applications in wireless home-media centers, streaming media infrastructure, content delivery, imaging, and other real-time applications.

According to TI, 1 GHz DSP performance will fuel consumer home products such as a media center for viewing HDTV on a variety of entertainment and productivity-enhancement devices, including TVs, PCs and PDAs, with no wires, while simultaneously recording high-definition content for later viewing. These applications match well with those forecast by Toshiba's Kazi for the intelligent home-entertainment system.


About the Author
Jim Lipman is a consultant providing marketing, writing, and other electronics industry services, specializing in EDA tools and ASIC/SoC design methodologies. His job experience includes chip-design R&D, marketing, marcom, technical editing, and on-line publishing of technical content for engineers.


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