News & Analysis
Intersil to co-develop a next-generation power management platform with Tower Semiconductor
Paul Buckley
8/13/2009 10:13 AM EDT
A Memorandum of Understanding (MOU) has been signed by the companies which shall be followed by a formal agreement.
The multi-year agreement will combine Tower's technology expertise with Intersil's design and process technology capabilities to provide Intersil with an innovative platform, accelerating its power management product growth to address next-generation requirements. Intersil will utilize the platform to manufacture its leading-edge power ICs in Tower's state-of-the-art 200 mm facility in Migdal Ha'emek, Israel.
Intersil already has an established relationship with Jazz Semiconductor, Tower's wholly owned subsidiary, utilizing previous generation power management platforms. The new collaboration will enable further engineering relationships across a wide set of process technologies that could bring additional business to both companies.
Tower's Bipolar-CMOS-DMOS (BCD) power process offering is highly modular and includes a Y-Flash zero mask adder non-volatile memory (NVM) solution. Combined with Intersil's power management design and process capabilities, this new process will go beyond its base platform to specifically address the requirements of multiple Intersil product families including digital power, PWM controllers and PMICs for a broad set of end user markets such as consumer, computing, communications, industrial and automotive.
Sagar Pushpala, Senior Vice President Worldwide Operations and Technology, at Intersil, said: "Tower provides best-in-class BCD process technology which enables Intersil to offer highly-differentiated power management and non-volatile memory solutions."
Related links:
Tower and Jazz Semiconductor targets power management with scalable RDS(on) design tool
Tower, Triune team on power management IC platform
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