Update: Aptina rolls sensors, tips backside technology

The San Jose-based company also announced its plans to introduce backside illumination (BSI) image sensor technology in the second half of 2010. This will address those applications requiring 1.1-micron pixels and below.

''Our goal is to push FSI as long as possible,'' said Bob Gove, president and chief technology officer at the company. ''FSI in larger pixels enables optimal video. BSI will enable the push to higher megapixels in the future.''

FSI is the principal technology used in image sensors today. For high-quality HD video, 1.4- and 1.75-micron FSI pixels are expected to have a long life, according to Aptina.

BSI technology is finding use in higher-end consumer cameras where paying a premium for the sensor is less of a concern for the manufacturer. As future applications require 1.1-micron sensors, BSI is expected to be required as FSI may be unable to achieve the required performance, according to the firm.

At Micron, the company plans to devise BSI-based products using both chip-scale packaging (CSP) and through-silicon vias (TSVs), Gove said.

Aptina, which has 700 employees, continues to advance its technology after being spun-off from Micron Technology Inc. In 2008, Micron Technology spun-off its CMOS image sensor unit, thereby forming Aptina.

Privately-held Aptina has several investors, including Riverwood Capital, TPG Capital and Micron Technology. Aptina claims to be the leader in the CMOS image sensor market with 18.7 percent share in 2009, based on sales.

In its latest announcement, Aptina rolled out two products. The 3-megapixel MT9T113 and 5-megapixel MT9P017 image sensor solutions are based on Aptina’s third-generation A-Pix technology.

The third-generation A-Pix frontside illumination (FSI) image sensor technology enables improvements in quantum efficiency and crosstalk. It provides a 25 percent improvement in light level for the same signal-to-noise ratio performance over second generation technology, according to the company.

The pixel itself is based on 65-nm technology and copper interconnects, Gove said. The previous generation was based on 90-nm design rules, he said.

The MT9T113 provides the mobile market with a cost-effective, system-on-chip (SOC) 3-megapixel solution. The MT9P017 sensor with its 5-megapixel scheme extends Aptina’s range of advanced solutions targeting performance-oriented mobile manufacturers.

The MT9T113 includes JPEG thumbnail support, parallel and MIPI interfaces for ISP connection flexibility. It has a die size that enables a 6.5- x 6.5-mm module size. It also has advanced functionality like Scalado SpeedTags for image management. Additionally, the SOC provides high definition (HD) video at 720p at 30 frames per second.

The MT9P017 is a 5MP mobile image sensor. Its one-quarter-inch optical format and small die size are suited for integration into 6.5- x 6.5-mm modules. It supplies parallel and MIPI interfaces as well as features such as adaptive noise reduction, integrated autofocus VCM driver, two dimensional (2D) dynamic defect correction, and resampled binning for smoother video.

Both the MT9T113 and MT9P017 are currently sampling with mass product scheduled for Q3 2010. Aptina's products are currently made at Micron. Fabless Aptina is also looking at other foundries beyond Micron.