News & Analysis

IBM, partners to report 22-nm FinFET SRAM

Peter Clarke

6/1/2010 6:24 AM EDT

LONDON — A research team comprising authors from IBM Research, GlobalFoundries, Toshiba and NEC has produced an SRAM cell with an area of 0.0063 square microns using FinFET transistors and optical lithography.

The authors are due to present a paper at the Symposium on VLSI Technology to be held in Honolulu, Hawaii, from June 15 to 17.

The authors claim the cell area produced by their work is the smallest SRAM cell produced using optical lithography. It is fabricated with a gate pitch of 80-nm and a fin pitch of 40-nm and is shown to be intended for the 22-nm node.

The cell is operational down to supply voltage of 0.4-V. A double-expose, double-etch (DE2) sidewall image transfer (SIT) process is used to produce the fins.

Related links and articles:

www.vlsisymposium.org/

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CDennison

6/1/2010 12:13 PM EDT

Select high resolution figures from this paper are available at:

http://www.vlsisymposium.org/word/tech_press_images.htm

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Peter Clarke

6/2/2010 11:53 AM EDT

Error corrected

Please note the same error is present in the last line of the original abstract

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