SAN FRANCISCO—Foundry company Globalfoundries Inc. will install a production extreme ultraviolet (EUV) lithography tool in the second half of 2012 and be using EUV in volume production by 2014 or 2015, a company executive said Wednesday (July 14).
Delivering a keynote address at the Semicon West tradeshow here, Gregg Bartlett senior vice president of technology and R&D at Globalfoundries, said his firm has chosen to forgo the purchase of a pre-production EUV tool. Several chip companies, including Intel Corp., Samsung Electronics Co. Ltd., Toshiba Inc. and leading foundry Taiwan Semiconductor Manufacturing Co. Ltd. have ordered pre-production EUV tools
from ASML Holding NV.
Bartlett said 193-nm immersion lithography using double patterning—a technique the industry has had to use to extend 193-nm lithography to advanced production nodes—has become so expensive that, to his surprise, he is hoping that EUV lithography will reduce manufacturing costs.
"We feel very strongly that the industry does need a cost-effective EUV lithography solution for volume manufacturing going forward," Bartlett said. "Failure for the industry is not an option."
(Sunnyvale, Calif.) will install the production EUV tool at its Fab 8 in Malta, N.Y., Bartlett said.
Based on a 13-nm wavelength technology, EUV is not targeted for production until the 15-nm node, though some believe it won't be in production until 2016 or later. Originally, EUV was targeted for the 65-nm node, but the technology has been pushed out due to the lack of power sources, resists, defect-free masks and other technologies.